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      AlN

      High Thermal Conductivity Aln Aluminum Nitride Ceramic Substrates


      US$1.00 - 50.00
      1?Piece?(MOQ)

      Application
      Electronic Devices, Power Supply, Semiconductors
      Material
      AlN
      Process
      Direct Bonded Copper
      Thickness
      Customized
      Flexural Strength
      450MPa
      Surface Roughness
      Ra 0.3-0.5

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