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OEM/ODMRoHS, CE

Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging

Name: Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: VfwpsbrdhmRa
Price: 7000.00 USD
Availability: InStock

By?Jiangsu Himalaya Semiconductor Co., Ltd.

US$7,000.00 - 70,000.00

1?Piece?(MOQ)

Customization

Available

After-sales Service

Free Training

Condition

New

Speed

Super High Speed

Precision

High Precision

Certification

RoHS, CE

Shipping Cost:?

Contact the supplier about freight and estimated delivery time.

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