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      Exposure
      US$76,000.00-80,000.00 / Set
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      What is 4CCD Alignment Semi Automatic Solder Mask Exposure Machine

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Set US$76,000.00-80,000.00 / Set

      Sepcifications

      • After-sales Service Provide Lifelong Technical Services
      • Warranty 12 Months
      • Usage Semiconductor, Microelectronics, PCB Exposure
      • Type Plate Exposure
      • Page Double Faced
      • Automatic Grade Semiautomatic
      • Product Type Machine
      • Proximity Exposure Vacuum Contact
      • Feature Size 2mil
      • Transport Package Standard Package, Wooden Package, Vacuum Package
      • Specification L2400*W1550*H2170mm
      • Trademark xinguanghui
      • Origin Shenzhen
      • Weight 1800kg
      • Power AC380V
      • Maximum Machining Size 630*730mm
      • Minimum Machining Size 305*350mm

      Product Description

      4CCDSingle resistance welding LED exposure machine Product Description 4CCD Auto Solder Mask Exposure Machine product model UVLED-A830L Production specifications PCB size 305*350~630*730(mm) Flim size 0.1~3.2(mm) PCB thickness 660*760(mm) intensity of light source ...

      Learn More

      Exposure Comparison
      Transaction Info
      Price US$76,000.00-80,000.00 / Set US$300,000.00-1,000,000.00 / Piece US$300,000.00-1,000,000.00 / Piece US$300,000.00-1,000,000.00 / Piece US$300,000.00-1,000,000.00 / Piece
      Min Order 1 Set 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets Southeast Asia, Mid East, Eastern Asia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      After-sales Service: Provide Lifelong Technical Services;
      Warranty: 12 Months;
      Usage: Semiconductor, Microelectronics, PCB Exposure;
      Type: Plate Exposure;
      Page: Double Faced;
      Automatic Grade: Semiautomatic;
      Product Type: Machine;
      Proximity Exposure: Vacuum Contact;
      Feature Size: 2mil;
      Weight: 1800kg;
      Power: AC380V;
      Maximum Machining Size: 630*730mm;
      Minimum Machining Size: 305*350mm;
      Usage: Semiconductor;
      Type: Image Setter;
      Page: Single Face;
      Automatic Grade: Automatic;
      Product Type: PCB Exposure;
      Proximity Exposure: Vacuum Contact;
      Feature Size: 0.35 um;
      Model: Mac-Dpb-Di50e;
      Light Source: Fiber Coupled Laser + DMD;
      Laser Power: 24 Watts;
      Wave Length: 395nm - 415nm UV Sensitive;
      Imaging Material: Conventional Dry Film, PCB Ink, Ldi Dry Film;
      Supported Substrate: Max: 630X730mm Min: 250X250mm;
      Substrate Thickness: 0.05mm to 5mm;
      Minimum Line Width / Line Distance: 50um / 50um;
      Line Width Accuracy: Within 4um;
      Depth of Focus: 300um;
      Layer Alignment Accuracy: 20um;
      Outer Layer Alignment Accuracy: 10um;
      Repeat Accuracy: 2um;
      File Format: Gerber274X, Gerber274D, Odb++;
      Productivity (535X610mm, 20 Mj/Cm2): 39s / Side;
      Usage: Semiconductor;
      Type: Image Setter;
      Page: Single Face;
      Automatic Grade: Automatic;
      Product Type: PCB Exposure;
      Proximity Exposure: Vacuum Contact;
      Feature Size: 0.35 um;
      Model: Mac-Dpb-Di50e;
      Light Source: Fiber Coupled Laser + DMD;
      Laser Power: 24 Watts;
      Wave Length: 395nm - 415nm UV Sensitive;
      Imaging Material: Conventional Dry Film, PCB Ink, Ldi Dry Film;
      Supported Substrate: Max: 630X730mm Min: 250X250mm;
      Substrate Thickness: 0.05mm to 5mm;
      Minimum Line Width / Line Distance: 50um / 50um;
      Line Width Accuracy: Within 4um;
      Depth of Focus: 300um;
      Layer Alignment Accuracy: 20um;
      Outer Layer Alignment Accuracy: 10um;
      Repeat Accuracy: 2um;
      File Format: Gerber274X, Gerber274D, Odb++;
      Productivity (535X610mm, 20 Mj/Cm2): 39s / Side;
      Usage: Semiconductor;
      Type: Image Setter;
      Page: Single Face;
      Automatic Grade: Automatic;
      Product Type: PCB Exposure;
      Proximity Exposure: Vacuum Contact;
      Feature Size: 0.35 um;
      Model: Mac-Dpb-Di50e;
      Light Source: Fiber Coupled Laser + DMD;
      Laser Power: 24 Watts;
      Wave Length: 395nm - 415nm UV Sensitive;
      Imaging Material: Conventional Dry Film, PCB Ink, Ldi Dry Film;
      Supported Substrate: Max: 630X730mm Min: 250X250mm;
      Substrate Thickness: 0.05mm to 5mm;
      Minimum Line Width / Line Distance: 50um / 50um;
      Line Width Accuracy: Within 4um;
      Depth of Focus: 300um;
      Layer Alignment Accuracy: 20um;
      Outer Layer Alignment Accuracy: 10um;
      Repeat Accuracy: 2um;
      File Format: Gerber274X, Gerber274D, Odb++;
      Productivity (535X610mm, 20 Mj/Cm2): 39s / Side;
      Usage: Semiconductor;
      Type: Image Setter;
      Page: Single Face;
      Automatic Grade: Automatic;
      Product Type: PCB Exposure;
      Proximity Exposure: Vacuum Contact;
      Feature Size: 0.35 um;
      Model: Mac-Dpb-Di50e;
      Light Source: Fiber Coupled Laser + DMD;
      Laser Power: 24 Watts;
      Wave Length: 395nm - 415nm UV Sensitive;
      Imaging Material: Conventional Dry Film, PCB Ink, Ldi Dry Film;
      Supported Substrate: Max: 630X730mm Min: 250X250mm;
      Substrate Thickness: 0.05mm to 5mm;
      Minimum Line Width / Line Distance: 50um / 50um;
      Line Width Accuracy: Within 4um;
      Depth of Focus: 300um;
      Layer Alignment Accuracy: 20um;
      Outer Layer Alignment Accuracy: 10um;
      Repeat Accuracy: 2um;
      File Format: Gerber274X, Gerber274D, Odb++;
      Productivity (535X610mm, 20 Mj/Cm2): 39s / Side;
      Supplier Name

      Shenzhen Xinguanghui Technology Co., Ltd.

      Gold Member Audited Supplier

      McLantis Technology (Shanghai) Co., Ltd.

      Gold Member Audited Supplier

      McLantis Technology (Shanghai) Co., Ltd.

      Gold Member Audited Supplier

      McLantis Technology (Shanghai) Co., Ltd.

      Gold Member Audited Supplier

      McLantis Technology (Shanghai) Co., Ltd.

      Gold Member Audited Supplier

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