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      Printed Board Circuit
      US$0.10-80.00 / Piece
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      What is Custom Design Multilayer Printed Board Circuit

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10-80.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Kb
      • Insulation Materials Epoxy Resin
      • Brand Abis
      • Transport Package Vacuum Packing
      • Specification Custom
      • Trademark Abis Circuits
      • Origin Shenzhen, China
      • Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
      • Board Thickness 0.2-8mm
      • Copper Thickness 0.5-10oz
      • Layers 1-32layers
      • Enig Thickness 1-3u''
      • Hard Gold Thickness 5-50u''
      • Certification UL, ISO9001&ISO14001, SGS, RoHS Report

      Product Description

      Custom Design Multilayer Printed Board Circuit ABIS CIRCUITS CO., LTD is a professional PCB manufacturer which is focus on double side, Multilayer and HDI pcb mass production. The company was established on 2006, We have two factories together(audited by UL,ISO9001/14001,SGS,RoHS report),And all ...

      Learn More

      Printed Board Circuit Comparison
      Transaction Info
      Price US$0.10-80.00 / Piece US$0.20-20.00 / Piece US$0.20-20.00 / Piece US$1.20-2.30 / PCS US$0.10-0.65 / PCS
      Min Order 1 Piece 10 Pieces 10 Pieces 1 PCS 1 PCS
      Payment Terms LC, T/T, PayPal, Western Union T/T T/T LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
      Quality Control
      Product Certification UL, ISO9001&ISO14001, SGS, RoHS Report RoHS, CCC, ISO RoHS, CCC, ISO - -
      Management System Certification - ISO9001:2015 ISO9001:2015 - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Kb;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
      Board Thickness: 0.2-8mm;
      Copper Thickness: 0.5-10oz;
      Layers: 1-32layers;
      Enig Thickness: 1-3u'';
      Hard Gold Thickness: 5-50u'';
      Type: Customized;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Type: Customized;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Immersional Gold;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Ucreate PCB;
      Board Thickness: 1.6mm;
      Surface Finihsing: Immersional Gold;
      Lead Time: 6-8 Working Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Immersional Gold;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Ucreate PCB;
      Board Thickness: 1.2~2.0mm;
      Surface Finihsing: Immersional Gold;
      Lead Time: 6-8 Working Days;
      Supplier Name

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier