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      PCB
      US$0.01-20.00 / Piece
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      What is Multilayer for Aerospace, Medical, Communication Computer Industry PCB

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.01-20.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V1
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Transport Package Vacuum Packing
      • Specification 300*200
      • Trademark Abis
      • Origin China
      • Layer Counts 1-20
      • Mateiral Fr/4, High Tg Fr/4, PTFE, Rogers, etc
      • Maxium Size 600*1200mm
      • Board Thickness 0.20mm-8.00mm
      • Surface Finish HASL, Enig, Chen. Tin, Fash Gold, Asp, Gold Finger

      Product Description

      ABIS CIRCUITS CO., LTD Briefly introduce our strengths: 1. A professional PCB manufacturer which was established on Oct, 2006 2. Focusing on double side, Multilayer and HDI pcb mass production 3. Two factories, one for small and middle volume orders, another for big volume and HDI ...

      Learn More

      PCB Comparison
      Transaction Info
      Price US$0.01-20.00 / Piece US$0.10-1.10 / Piece US$0.10 / Piece US$0.10 / Piece US$0.10 / Piece
      Min Order 1 Piece 1 Piece 100 Pieces 100 Pieces 100 Pieces
      Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification - ISO/Cqciatf/UL/RoHS/etc ISO/CQC/IATF/UL/RoHS ISO/CQC/IATF/UL/RoHS ISO/CQC/IATF/UL/RoHS
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V1;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Layer Counts: 1-20;
      Mateiral: Fr/4, High Tg Fr/4, PTFE, Rogers, etc;
      Maxium Size: 600*1200mm;
      Board Thickness: 0.20mm-8.00mm;
      Surface Finish: HASL, Enig, Chen. Tin, Fash Gold, Asp, Gold Finger;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Layer: 1-20;
      OEM/ODM: Support;
      Type: Fr4;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Computer;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Brand: No Brand;
      Layer: 1 to 20;
      Board Thickness: Board Thickness;
      Finished Inner Copper Thickness: H/H0z-4/40z;
      Type: Fr4;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Computer;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Brand: No Brand;
      Layer: 1 to 20;
      Board Thickness: Board Thickness;
      Finished Inner Copper Thickness: H/H0z-4/40z;
      Type: Fr4;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Computer;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Brand: No Brand;
      Layer: 1 to 20;
      Board Thickness: Board Thickness;
      Finished Inner Copper Thickness: H/H0z-4/40z;
      Supplier Name

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Jian Unice Pcb Technique Co., Ltd

      Gold Member Audited Supplier

      Jian Unice Pcb Technique Co., Ltd

      Gold Member Audited Supplier

      Jian Unice Pcb Technique Co., Ltd

      Gold Member Audited Supplier

      Jian Unice Pcb Technique Co., Ltd

      Gold Member Audited Supplier