| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: N/a;
Board Thickness: 1.6 mm;
Surface: Immersion Gold;
Solder Mask: Green;
Silk: White;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Organic-Ceramic Woven Fiberglass Reinforced Lamina;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Taconic;
Thickness: 25mil;
Layer Count: 2-Layer;
Application: Antennas;
Surface Finish: Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: Rt/Duroid 5880;
Material: PTFE Composite Reinforced with Glass Microfibers;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Surface Finish: Bare Copper;
Board Thickness: 1.6mm (Finished);
Layer Count: 2-Layer;
Solder Mask: None;
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