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Multi Layer PCB Circuit Manufacturing

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-80.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Kb
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification Custom
Trademark Abis Circuits
Origin Shenzhen, China
Certification UL,ISO9001&ISO14001,SGS,RoHS Report
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Board Thickness 0.2-6mm
Copper Thickness 0.5-8oz
Layers 1-20layers

Product Description

Multi Layer PCB Circuit Manufacturing ABIS CIRCUITS CO., LTD is a professional PCB manufacturing which is focus on double side, Multilayer and HDI pcb mass production. The company was established on 2006, We have two factories together(audited by UL,ISO9001/14001,SGS,RoHS report) ,And all ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Circuit Manufacturing Comparison

	Multi Layer PCB Circuit Manufacturing Contact Now	Quick View Quick Turn High Tg Rigid Multilayer Rigid PCB Assembly Fabrication Circuit Board Cost Contact Now	Quick View Custom Circuit Board PCB Quick Turn Prototype Fabrication Cost PCB Assembly Price Contact Now	Quick View RF Amplifier Signal Communication Communication Module Microwave RF Receiver PCB Contact Now	Quick View Qingdao Shanyo High-Frequency Multi-Layer Electronic Printed Circuit Boards PCB Assembly Contact Now

Transaction Info
	Multi Layer PCB Circuit Manufacturing Contact Now	Quick View Quick Turn High Tg Rigid Multilayer Rigid PCB Assembly Fabrication Circuit Board Cost Contact Now	Quick View Custom Circuit Board PCB Quick Turn Prototype Fabrication Cost PCB Assembly Price Contact Now	Quick View RF Amplifier Signal Communication Communication Module Microwave RF Receiver PCB Contact Now	Quick View Qingdao Shanyo High-Frequency Multi-Layer Electronic Printed Circuit Boards PCB Assembly Contact Now
Price	US$0.10-80.00 / Piece	US$2.00-5.00 / Piece	US$2.00-5.00 / Piece	US$2.00-5.00 / Piece	US$0.20-5.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	LC, T/T, D/P, Western Union, Small-amount payment, PayPal	LC, T/T, D/P, Western Union, Small-amount payment, PayPal	LC, T/T, D/P, Western Union, Small-amount payment, PayPal	T/T, D/P, LC, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	UL,ISO9001&ISO14001,SGS,RoHS Report	-	-	-	-
Management System Certification	-	-	-	-	ISO9001:2015, ISO45001:2018, ISO14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Europe	Europe	Europe	North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	59,508,592 RMB	59,508,592 RMB	59,508,592 RMB	-
Business Model	-	OEM	OEM	OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Flexible Circuit Board; Dielectric: Fr4, Fr-1, Cem-3; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Shanyo; Sample: Free; Switch Stroke: Flat Type 0.1-0.5mm; Color: Clear Metal Color; Dimension/Shape: OEM Service; Keypad Button Material: Metal;
Supplier Name	Abis Circuits Co., Ltd.	Finest Printed Circuit Board Ltd.	Finest Printed Circuit Board Ltd.	Finest Printed Circuit Board Ltd.	Qingdao Shanyo Precision Electronic Technology Co., Ltd.
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