| Specification |
Type: Rigid Circuit Board;
Dielectric: Alu;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: N/a;
Materials: Fr4;
Thickness: 1.6mm;
Mask: Blue;
Silk: Black;
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Type: IC Substrate;
Dielectric: Bt;
Material: Bt;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Bt;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: IC Substrate Board Bt Substrate PCB;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Copper Thickness: 0.5oz-6oz;
Min. Hole Size: 0.1mm;
Min.Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Functional Application: Industrial Control/Consumer Electronics/Other;
Board Thickness: 0.8mm~3.0mm;
Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating;
Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing;
Number of Layers: 1-6 Layers;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Copper Thickness: 0.5oz-6oz;
Min. Hole Size: 0.1mm;
Min.Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Functional Application: Industrial Control/Consumer Electronics/Other;
Board Thickness: 0.8mm~3.0mm;
Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating;
Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing;
Number of Layers: 1-6 Layers;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mu Star;
Solder Mask Color: Green, Red, Black (as Your Require);
Silkscreen Color: White, Black;
Testing Service: Ict, Function Test, X-ray, Aoi;
Layers: 1-64;
MOQ: 5PCS;
Warranty: 2 Years;
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