| Specification |
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
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Dielectric: Aluminium Base PCB;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 1.0 mm;
Copper Thickness: 2 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Lead Time: 5-6 Working Days;
Surface Finish: OSP, Immersion Gold, Immersion Tin;
Hole Size Tolerance (Npth): +/- 2 Mils (+/- 0.05 mm);
Minimum Pad-to-Pad Tol.: +/-3 Mils (+/-; 0.76 mm);
Impedance Control: +/-10% (Differential);
Aspect  Ration : 16:1;
MOQ: 1 PCS;
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Dielectric: FR-4;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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Dielectric: FR-4;
Board Thickness: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Solder Mask: Green and Yellow;
Silk Screen: White;
Material: Fr4 + Polymide;
PCB Type: Rigid-Flexible PCB;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 5-10 Days;
Service: High Quality;
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Dielectric: FR-4;
Board Thickness: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Solder Mask: Green and Yellow;
Silk Screen: White;
Material: Fr4 + Polymide;
PCB Type: Rigid-Flexible PCB;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 5-10 Days;
Service: High Quality;
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