Fr4 PCB

US$4.89-6.75 / Piece

Bluetooth Audio Amplifier Board PCB Circuit Board PCB Assembly for Electronic pictures & photos

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What is Bluetooth Audio Amplifier Board PCB Circuit Board PCB Assembly for Electronic

Name: Bluetooth Audio Amplifier Board PCB Circuit Board PCB Assembly for Electronic
Uploaded: 2026-03-23T08:28:22+08:00
Description: Bluetooth Audio Amplifier Board pcb circuit board pcb Assembly for electronic Product Description Fastline PCB's aim Customer

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Price

Min. Order Reference FOB Price

1 Piece US$4.89-6.75 / Piece

Sepcifications

Structure Double-Sided Rigid PCB
Dielectric FR-3
Material Phenolic Paper Laminate
Application Computer
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Semi-Additive Process
Base Material Fr4
Insulation Materials Organic Resin
Transport Package Vacuum Packing
Specification IP class -2
Trademark Fastline
Origin Shenzhen, China
Board Material Fr4
Layers 1 to 30 Layers
Board Thickness 1.6mm
Copper Thickness 1oz
Solder Mask Green
Silk Screen White
Surface Treatment HASL Lead Free
Test 100%
Lead Time 6-8 Working Days
Min. Line Width 0.075mm

Product Description

Bluetooth Audio Amplifier Board pcb circuit board pcb Assembly for electronic Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Fr4 PCB Comparison

	Bluetooth Audio Amplifier Board PCB Circuit Board PCB Assembly for Electronic Contact Now	Quick View Red Ink Printed Circuit Board PCB Manufacturer with ISO14001 ISO9001 UL Contact Now	Quick View Multilayer PCB Circuit Board Made of Halogen-Free, Metal Substrates, High Frequency, High Tg Materials Contact Now	Quick View Shenzhen China PCB Electronic Contract Manufacturing Printing Circuit Board Contact Now	Quick View Printed Circuit Board PCB Assembly PCBA Manufacturer Contact Now

Transaction Info
	Bluetooth Audio Amplifier Board PCB Circuit Board PCB Assembly for Electronic Contact Now	Quick View Red Ink Printed Circuit Board PCB Manufacturer with ISO14001 ISO9001 UL Contact Now	Quick View Multilayer PCB Circuit Board Made of Halogen-Free, Metal Substrates, High Frequency, High Tg Materials Contact Now	Quick View Shenzhen China PCB Electronic Contract Manufacturing Printing Circuit Board Contact Now	Quick View Printed Circuit Board PCB Assembly PCBA Manufacturer Contact Now
Price	US$4.89-6.75 / Piece	US$0.01-150.00 / Piece	US$0.01-10.00 / Piece	US$0.01-150.00 / Piece	US$0.01-150.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Kb; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Surface Finishing: Enig 3u''; Board Thickness: 0.2-6.0mm; Min Line Width: 0.15mm; Min Hole Size: 0.10mm;	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Surface Finish: Enig; Solder Mask: Blue; Legend: White;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Surface Finishing: Enig 2u''; PCB Material: PCB; Solder: Green; Silk: White;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Surface Finishing: Enig 2u''; Raw Material: Fr-4.High Tg Fr-4.PTFE.Aluminum Base; Board Thickness: 0.20mm--8.00mm; Layer: 1 Layer-20 Layer;
Supplier Name	Fastline Circuits Co., Limited	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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