| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
PCB Design: Custom Design Product;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
Board Material: Fr4;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: Jx-PCBA;
Brand: OEM;
PCBA Material: FR4, High TG, Halogen-Free, High Frequency;
Component Packing: Tary, Tube, Tape;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Line Width/Spacing: 3.0mil;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
PCB Silkscreen Color: Black, White, Yellow;
Number of Layers: 1-32;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Service: One-Stop Turnkey;
Maximum Board Size: 640mm*1100mm;
PCBA Board Thickness: 0.2mm-6.0mm;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: New Chip;
PCBA-Testing: X-ray, Aoi;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: UC;
Board Layer: 1-24;
Board Thickness: 0.4-3.2 mm;
Soldermask Color: Green/White/Black/Blue/Red;
Surface Finish: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
Lead Time: 5+ Working Days;
Fast Turn: 2+ Working Days;
Ipc Standards: Ipc Class II;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Flame Retardant Properties: 94 V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: PCB;
Layer: 1 to 20;
Mini Board Size: 8*8mm;
Max Board Size: 650*610mm;
Board Thickness: 0.3mm~3.5mm;
Finished Inner Copper Thickness: H/H0z-4/40z;
Finished Outer Copper Thickness: H/H0z-5/50z;
Min Hole Size: 0.2mm;
Heat Conductivity: 1.5 to 3W;
Surface Finishing: OSP, HASL, Gold Plating, Enig, Immersion Gold;
Warranty: 1 Year;
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