HDI Multi Layer Octa Core Android 14 Linux PCBA

US$0.98-2.00 / Piece

HDI Multi Layer Octa Core Android 14 Linux Fast Prototype PCB PCBA Rk3576 Industrial Control WiFi 4/5g CPU 2.2GHz 3576 Soc Industrial Embedded Core Motherboard pictures & photos

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What is HDI Multi Layer Octa Core Android 14 Linux Fast Prototype PCB PCBA Rk3576 Industrial Control WiFi 4/5g CPU 2.2GHz 3576 Soc Industrial Embedded Core Motherboard

Name: HDI Multi Layer Octa Core Android 14 Linux Fast Prototype PCB PCBA Rk3576 Industrial Control WiFi 4/5g CPU 2.2GHz 3576 Soc Industrial Embedded Core Motherboard
Uploaded: 2026-03-01T08:52:24+08:00
Description: Company Profile Welcome to Fastline Fastline Circuits Co., Limited, a leading PCB/PCBA contract manufacturer in China since 2006, specializes in delivering tailored manufacturing solutions to globa

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Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$2.00

1,000-9,999 Pieces US$1.86

10,000+ Pieces US$0.98

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Transport Package Vacuum Packing
Specification IP class -2
Trademark Fastline
Origin Shenzhen, China
Board Material Fr4
Board Thickness 1.6mm
Copper Thickness 1oz
Solder Mask Green
Silk Screen White
Surface Treatment HASL Lead Free
Test 100%
Lead Time 6-8 Working Days
Min. Line Width 0.075mm
Layer 1-50layers
Supply Fast
Min Hole 0.1mm
MOQ 1PCS
Service One-Stop
File PCB File

Product Description

Company Profile Welcome to Fastline Fastline Circuits Co., Limited, a leading PCB/PCBA contract manufacturer in China since 2006, specializes in delivering tailored manufacturing solutions to global electronics clients. We serve over 40 countries across telecom, industrial control, medical ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

HDI Multi Layer Octa Core Android 14 Linux PCBA Comparison

	HDI Multi Layer Octa Core Android 14 Linux Fast Prototype PCB PCBA Rk3576 Industrial Control WiFi 4/5g CPU 2.2GHz 3576 Soc Industrial Embedded Core Motherboard Contact Now	Quick View Antenna Rogers/Taconic/Arlon/PTFE/Isola High Frequency Electronics Multilayer PCB Solutions Contact Now	Quick View Rogers/Arlon/Isola/ Taconic High Frequency Electronic PCB Board for Telecommunications Contact Now	Quick View High Frequency Electronics Printed Circuit Board Prototype Manufacturer Roger PCB Solutions Contact Now	Quick View Rogers/PTFE/Arlon/Taconic/Isola High Frequency Electronics Prototype Multilayer PCB Solutions Contact Now

Transaction Info
	HDI Multi Layer Octa Core Android 14 Linux Fast Prototype PCB PCBA Rk3576 Industrial Control WiFi 4/5g CPU 2.2GHz 3576 Soc Industrial Embedded Core Motherboard Contact Now	Quick View Antenna Rogers/Taconic/Arlon/PTFE/Isola High Frequency Electronics Multilayer PCB Solutions Contact Now	Quick View Rogers/Arlon/Isola/ Taconic High Frequency Electronic PCB Board for Telecommunications Contact Now	Quick View High Frequency Electronics Printed Circuit Board Prototype Manufacturer Roger PCB Solutions Contact Now	Quick View Rogers/PTFE/Arlon/Taconic/Isola High Frequency Electronics Prototype Multilayer PCB Solutions Contact Now
Price	US$0.98-2.00 / Piece	US$0.10-20.00 / Piece	US$0.10-20.00 / Piece	US$0.10-15.00 / Piece	US$0.10-20.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment, VTB	T/T, PayPal, Western Union, Small-amount payment, VTB	T/T, PayPal, Western Union, Small-amount payment, VTB	T/T, PayPal, Western Union, Small-amount payment, VTB
Quality Control
Product Certification	-	-	RoHS, UL CE, GS, ISO	-	RoHS, UL CE, GS, ISO
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Board Material: Fr4; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm; Layer: 1-50layers; Supply: Fast; Min Hole: 0.1mm; MOQ: 1PCS; Service: One-Stop; File: PCB File;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: EEG;	Type: Rigid Circuit Board; Dielectric: Rogers; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Exceeding; Delivery: 24hours~5 Days; Price: Factory Price; Keyword: Custom PCB; Product Name: High Frequency Board; MOQ: 1 PCS; Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil); Min. Line Width: 0.075mm(3mil); Copper Thickness: 0.5-12oz(18-420um); Min. Line Spacing: 0.075mm(3mil); Board Thickness: 0.2-6.0mm; Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free; Service: One-Stop Service, PCB Assembly, Component Supply; Testing Service: 100% E-Testing;	Type: Rigid Circuit Board; Dielectric: Rogers; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: EEG;	Type: Rigid Circuit Board; Dielectric: Rogers; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Exceeding; Delivery: 24hours~5 Days; Price: Factory Price; Keyword: Custom PCB; Product Name: High Frequency Board; MOQ: 1 PCS; Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil); Min. Line Width: 0.075mm(3mil); Copper Thickness: 0.5-12oz(18-420um); Min. Line Spacing: 0.075mm(3mil); Board Thickness: 0.2-6.0mm; Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free; Service: One-Stop Service, PCB Assembly, Component Supply; Testing Service: 100% E-Testing;
Supplier Name	Fastline Circuits Co., Limited	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED
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