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      Printed Circuit Board
      US$0.33-0.46 / piece
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      What is High Quality Printed Circuit Board for Rigid PCB Board

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 piece US$0.46

      100+ piece US$0.33

      Sepcifications

      • Structure Double-Sided Rigid PCB, Multilayer Rigid PCB
      • Dielectric Fr-3, Fr-4
      • Material Aluminum
      • Application Computer, Consumer Electronics
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Semi-Additive Process, Subtractive Process
      • Base Material Fr4, Copper
      • Insulation Materials Organic Resin
      • Brand Fastline
      • Transport Package Vacuum Packing
      • Specification IP class -2
      • Trademark Fastline
      • Origin Shenzhen, China
      • Board Material Fr4
      • Layers 1 to 30 Layers
      • Board Thickness 1.6mm
      • Copper Thickness 1oz
      • Solder Mask Green
      • Silk Screen White
      • Surface Treatment HASL Lead Free
      • Test 100%
      • Lead Time 6-8 Working Days
      • Min. Line Width 0.075mm

      Product Description

      High Quality Printed Circuit Board for Rigid PCB Board Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and high efficiency ...

      Learn More

      Printed Circuit Board Comparison
      Transaction Info
      Price US$0.33-0.46 / piece US$0.50-6.00 / Piece US$2.18 / Piece US$2.18 / Piece US$2.18 / Piece
      Min Order 1 piece 1 Piece 10 Pieces 10 Pieces 10 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Management System Certification - Others Others Others Others
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Double-Sided Rigid PCB, Multilayer Rigid PCB;
      Dielectric: Fr-3, Fr-4;
      Material: Aluminum;
      Application: Computer, Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process, Subtractive Process;
      Base Material: Fr4, Copper;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Fr4;
      Layers: 1 to 30 Layers;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask: Green;
      Silk Screen: White;
      Surface Treatment: HASL Lead Free;
      Test: 100%;
      Lead Time: 6-8 Working Days;
      Min. Line Width: 0.075mm;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Jingxin;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxy Paper Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Additive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      MOQ: at Least 1piece;
      Delivery Term: Fob Shenzhen;
      Payment Term: by T/T in Advance;
      Leadtime: 15days After Receipt of Your Full Payment;
      Component Packing: Tary, Tube, Tape;
      Number of Floors: 1-32;
      Minimum Line Width/Spacing: 3.0mil;
      Maximum Plate Thickness Aperture Ratio: 30:1;
      Minimum Mechanical Drilling Aperture: 6mil;
      Board Thickness: 0.2mm~6.0mm;
      Maximum Board Size: 640mm*1100mm;
      PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxy Paper Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Additive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      MOQ: at Least 1piece;
      Delivery Term: Fob Shenzhen;
      Payment Term: by T/T in Advance;
      Leadtime: 15days After Receipt of Your Full Payment;
      Component Packing: Tary, Tube, Tape;
      Number of Floors: 1-32;
      Minimum Line Width/Spacing: 3.0mil;
      Maximum Plate Thickness Aperture Ratio: 30:1;
      Minimum Mechanical Drilling Aperture: 6mil;
      Board Thickness: 0.2mm~6.0mm;
      Maximum Board Size: 640mm*1100mm;
      PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxy Paper Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Additive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      MOQ: at Least 1piece;
      Delivery Term: Fob Shenzhen;
      Payment Term: by T/T in Advance;
      Leadtime: 15days After Receipt of Your Full Payment;
      Component Packing: Tary, Tube, Tape;
      Number of Floors: 1-32;
      Minimum Line Width/Spacing: 3.0mil;
      Maximum Plate Thickness Aperture Ratio: 30:1;
      Minimum Mechanical Drilling Aperture: 6mil;
      Board Thickness: 0.2mm~6.0mm;
      Maximum Board Size: 640mm*1100mm;
      PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier