| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Compressor Driver Inverter Control Board;
Product Name: 180 °Sinusoidal DC Inverter Driver;
Application: DC Frequency Inverter Compressor;
Rated Input Voltage: 380V 50/60Hz;
Input Maximum Power: 15kw 380V AC;
Input Maximum Current: 25A;
Communication: Standard RS485 Isolation Design, Baud Rate 1200BPS;
Output Hz: 15-120Hz;
Pfc: PF Value (0.90-0.99);
Carrier Frequency: 5.0kHz;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Number of Layers: Custom;
Copper Thickness: 1 Oz;
Product Name: PCB Assembly;
Surface Finishing: HASL;
Transport: EMS,DHL,UPS,FedEx,TNT;
Board Thickness: Custom, 1.6mm;
Testing Service: Ict,Fct,X-ray,Aoi;
Packaging Details: ESD Package with Cartons.;
Test: 100% Aoi / X-ray / Visual Test;
Min. Line Width: 0.075(3mil);
Supplier Type: OEM;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Test: Flying Probe and Fixture;
Solder Mask: Green / Black / Blue;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 1.6mm / 0.8mm / Custom;
Custom: OEM / ODM;
Copper: 2oz / 70um;
Legend: White;
Surface Finish: L-F HASL / Enig;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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