| Specification |
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: PCBA PCB Assembly;
Assembly Process: SMT DIP Mixed Technology;
Surface Finish: HASL Enig OSP Immersion Silver Gold Plating;
Solder Type: Lead-Free with Lead RoHS Compliant;
Testing Methods: Aoi Ict X-ray Functional Test;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;;
Soldermask Color: White, Black, Green, Blue etc.;;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;;
Conditions: New;
Finished Thickness: 0.8~1.6mm;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
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