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      PCB Assembly
      US$0.89-6.00 / Piece

      Fr4 PCB Assembly PCBA Program Clone Printed Develop Circuit Board Develop Manufacturer Video

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      10-999 Pieces US$6.00

      1,000-4,999 Pieces US$3.10

      5,000+ Pieces US$0.89

      Sepcifications

      • Metal Coating Copper
      • Mode of Production SMT
      • Layers Multilayer
      • Base Material FR-6
      • Certification ISO
      • Customized Customized
      • Condition New
      • Transport Package Antistatic Package+Plastic Box and Carton Box
      • Specification Customized
      • Trademark Customized
      • Origin Shenzhen China
      • PCBA-Testing X-ray, Aoi
      • Processing Electrolytic Foil
      • SMT Capacity >2 Million Points/Day
      • DIP Capacity >100K Parts/Day
      • Min. Space of BGA +/- 0.3mm
      • Min.Pin Space of IC 0.3mm
      • Max.Precision of IC Assembly 0.03mm
      • Surface Finishing Lead-Free HASL
      • Number of Layers 4-10 Layer
      • Board Thickness 1.6mm

      Product Description

      FR4 PCB Assembly PCBA Program Clone Printed Develop Circuit Board Develop Manufacturer Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB fabrication drawing and ...

      Learn More

      PCB Assembly Comparison
      Transaction Info
      Price US$0.89-6.00 / Piece US$3.50 / Piece US$3.50 / Piece US$1.88 / Piece US$1.88 / Piece
      Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T T/T T/T T/T T/T
      Quality Control
      Product Certification ISO RoHS, ISO, ISO13485 RoHS, ISO, ISO13485 ISO 13485 ISO 13485
      Management System Certification ISO9001:2015 - - - -
      Trade Capacity
      Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-6;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Testing: X-ray, Aoi, Ict, Fct;
      Small Order: Acceptable;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Material: Complex;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Testing: X-ray, Aoi, Ict, Fct;
      Small Order: Acceptable;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Material: Complex;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Production Time: Within 4 Weeks;
      Copper Thickness: 1-4oz;
      Keywords: Multilayer Electronic Circuit Board;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Production Time: Within 4 Weeks;
      Copper Thickness: 1-4oz;
      Keywords: Multilayer Electronic Circuit Board;
      Supplier Name

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier