Multilayers Rigid Motherboard PCBA Printed Circuit Board Assembly Video

Name: Multilayers Rigid Motherboard PCBA Printed Circuit Board Assembly
Uploaded: 2026-03-11T11:28:22+08:00
Description: Multilayers Rigid Motherboard PCBA Printed Circuit Board Assembly Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$5.00

1,000-4,999 Pieces US$2.21

5,000+ Pieces US$0.98

Sepcifications

Type Flexible Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Fexible
Processing Technology Customized
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand OEM/ODM
Transport Package Antistatic Package+Plastic Box and Carton Box
Specification Customized
Trademark Customized
Origin Shenzhen China
PCBA-Testing X-ray, Aoi
Processing Electrolytic Foil
SMT Capacity >2 Million Points/Day
DIP Capacity >100K Parts/Day
Certification RoHS, CCC, ISO
Min. Space of BGA +/- 0.3mm
Min.Pin Space of IC 0.3mm
Max.Precision of IC Assembly 0.03mm
Surface Finishing Lead-Free HASL
Number of Layers 4-10 Layer
Board Thickness 1.6mm

Product Description

Multilayers Rigid Motherboard PCBA Printed Circuit Board Assembly Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB fabrication drawing and PCBA assembly drawing. ...

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Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Self Service KIOSK
Management System Certification ISO9001:2015
Address 1/F & 7/F, Phenix Technology Building, Phenix?Community, Baoan District, 518103, Shenzhen, Guangdong, China
ODM Service Available Yes
OEM Service Available Yes

PCB Assembly Comparison

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Transaction Info
	Multilayers Rigid Motherboard PCBA Printed Circuit Board Assembly Contact Now	High-Power & High-Frequency Hybrid PCB Solutions Combining Thermal Management & Signal Integrity Expertise Contact Now	Quick View Risc-V Architecture PCBA IC Chip Processors Customizable Core Solutions for Edge Ai Embedded Systems Contact Now	Quick View High-Frequency Clock Generators PCBA & Timing Ics Ultra-Low Jitter for 5g Infrastructure & Data Centers Contact Now	PCB Fast Supply for Power Electronics Manufacturing PCB Contact Now
Price	US$0.98-5.00 / Piece	US$0.86-2.48 / Piece	US$0.22-0.58 / Piece	US$0.22-0.58 / Piece	US$0.22-0.58 / Piece
Min Order	10 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	RoHS, CCC, ISO	-	-	-	-
Management System Certification	ISO9001:2015	-	-	-	-
Trade Capacity
Export Markets	Domestic	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Fastline; Board Thickness: 1.6mm; Board Layer: 14 Layers; Copper Thickness: 1 Oz; Solder Mask: Green; Silksreen: White; Surface Finihsing: OSP; Lead Time: 6-8 Working Days; Min. Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Board Material: Fr4; File: PCB File; MOQ: 1 PCS; Supply: Fast; Service: One-Stop; Mini Trace: 3mil / 3mil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL; Base Material: Fr4; Insulation Materials: Fr4; Brand: Fastline; Board Material: Fr-4 (Tg 135 ); Board Thickness: 1.6 mm; Copper Thickness: 1 Oz (35um); Surface Treatment: HASL Lead Free; Solder Mask: Green; Silk Screen: White; Flying Probe Test: Yes; Mini Hole: 0.1mm; Mini Trace: 3 Mil / 3 Mil; MOQ: 1 PCS; Supply: Fast; Service: One-Stop; File: PCB File; Lead Time: 5-6 Days; Test: 100%;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL; Base Material: Fr4; Insulation Materials: Fr4; Brand: Fastline; Board Material: Fr-4 (Tg 135 ); Board Thickness: 1.6 mm; Copper Thickness: 1 Oz (35um); Surface Treatment: HASL Lead Free; Solder Mask: Green; Silk Screen: White; Flying Probe Test: Yes; Mini Hole: 0.1mm; Mini Trace: 3 Mil / 3 Mil; MOQ: 1 PCS; Supply: Fast; Service: One-Stop; File: PCB File; Lead Time: 5-6 Days; Test: 100%;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL; Base Material: Fr4; Insulation Materials: Fr4; Brand: Fastline; Board Material: Fr-4 (Tg 135 ); Board Thickness: 1.6 mm; Copper Thickness: 1 Oz (35um); Surface Treatment: HASL Lead Free; Solder Mask: Green; Silk Screen: White; Flying Probe Test: Yes; Mini Hole: 0.1mm; Mini Trace: 3 Mil / 3 Mil; MOQ: 1 PCS; Supply: Fast; Service: One-Stop; File: PCB File; Lead Time: 5-6 Days; Test: 100%;
Supplier Name	Shenzhen Hongzhou Smart Technology Co., Ltd.	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited
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