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      Mini PC
      US$155.46-187.65 / Piece
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      What is Hystou Win10/11 Mini PC Nuc Linux Optional Desktop Embedded N100 Firewall Factory Computer

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$155.46-187.65 / Piece

      Sepcifications

      • Application Field Industrial Control
      • Processor Type Intel
      • Stratification HardWare Layer
      • Range of Application General
      • Certification CE, RoHS, FCC
      • Type Embedded Systems
      • Transport Package 305*205*75mm
      • Specification N/W 1.3kg; G/W 2.0kg
      • Trademark HYSTOU
      • Origin China
      • CPU Intel Alder Lake N100
      • USB Port 2*USB 3.0+4*USB 2.0
      • LAN 4*RJ45 LAN 2.5g Gigabit Ethernet Controller,Intel
      • Memory Types 1*DDR5 So-DIMM 262 Pin
      • Display 1*HDMI+1*Dp
      • Operating System Support Windows 10/11, Linux
      • SIM 1*SIM Slot, Support Simcard(9*12mm)
      • Dimension PC Size 177*125*55mm

      Product Description

      Product Description HYSTOU Industrial Fanless Intel Alder Lake N100 4 LAN Pfsense Firewall Mini PC Explore new worlds and discover the wonders of the mini computer! Welcome to our mini computer, a tiny machine with powerful functions. It can help you complete various tasks and can be carried ...

      Learn More

      Mini PC Comparison
      Transaction Info
      Price US$155.46-187.65 / Piece US$28.00-50.00 / Piece US$117.00-156.00 / Piece US$121.00-160.00 / Piece US$85.00-112.00 / Piece
      Min Order 1 Piece 2 Pieces 2 Pieces 2 Pieces 2 Pieces
      Payment Terms LC, T/T, PayPal, Western Union, Money Gram, Visa Card LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia
      Annual Export Revenue - - - - -
      Business Model ODM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Application Field: Industrial Control;
      Processor Type: Intel;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: Embedded Systems;
      CPU: Intel Alder Lake N100;
      USB Port: 2*USB 3.0+4*USB 2.0;
      LAN: 4*RJ45 LAN 2.5g Gigabit Ethernet Controller,Intel;
      Memory Types: 1*DDR5 So-DIMM 262 Pin;
      Display: 1*HDMI+1*Dp;
      Operating System: Support Windows 10/11, Linux;
      SIM: 1*SIM Slot, Support Simcard(9*12mm);
      Dimension: PC Size 177*125*55mm;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Name: Rk3566 Som;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
      OS: Android 13 Debian 11.6;
      GPU: Mali-G610 MP4, 450 Gflops;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som+ Carrier Board;
      Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
      OS: Android 13 Debian 11.6;
      GPU: Mali-G610 MP4, 450 Gflops;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som+ Carrier Board;
      Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
      OS: Android 13 Debian 11.6;
      GPU: Mali-G610 MP4, 450 Gflops;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Supplier Name

      Shenzhen Fannis Technology Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier