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      Desktop Mini Computer
      US$181.62-215.65 / units
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      What is Hystou Intel Core I3 10th Desktop DDR4 Fanless Industrial Dual LAN Desktop Computer CNC Embedded Hardware for Home Factory Mini PC

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9 units US$215.65

      10-99 units US$199.38

      100+ units US$181.62

      Sepcifications

      • Application Field Industrial Control
      • Processor Type Intel
      • Stratification HardWare Layer
      • Range of Application General
      • Bus Type Not Bus Type
      • Certification CE, RoHS, FCC
      • Type Embedded Systems
      • Machine Word-Length 4
      • Instruction Type RISC
      • Transport Package Normal Color Express Box
      • Specification PC size 170*126*58mm Package size 308*206*75mm
      • Trademark HYSTOU
      • Origin Guangdong, China
      • CPU Intel Core I3-10110u
      • Storage 1*M.2 2280 Slot+1*SATA3.0 Slot
      • LAN 2*RJ45 LAN Gigabit Ethernet Controller, Realtek 81
      • USB Port 4*USB 3.0 Port,4*USB 2.0 Port
      • Memory Types 2*DDR4 So-DIMM 260 Pin
      • Max Memory Size 64GB
      • Processor Graphics Intel UHD Graphics

      Product Description

      VR Details Images The HYSTOU H7-10th mini computer is a compact powerhouse, delivering robust performance and ample storage customized to your specific needs. Its exceptional capabilities are perfect for optimizing office space, supporting business trips, or seamlessly connecting various media ...

      Learn More

      Desktop Mini Computer Comparison
      Transaction Info
      Price US$181.62-215.65 / units US$68.00-91.00 / Piece US$50.00-67.00 / Piece US$50.00-67.00 / Piece US$89.00-129.00 / Piece
      Min Order 1 units 2 Pieces 2 Pieces 2 Pieces 2 Pieces
      Payment Terms LC, T/T, PayPal, Western Union, Money Gram, Visa Card LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia
      Annual Export Revenue - - - - -
      Business Model ODM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Application Field: Industrial Control;
      Processor Type: Intel;
      Stratification: HardWare Layer;
      Range of Application: General;
      Bus Type: Not Bus Type;
      Type: Embedded Systems;
      Machine Word-Length: 4;
      Instruction Type: RISC;
      CPU: Intel Core I3-10110u;
      Storage: 1*M.2 2280 Slot+1*SATA3.0 Slot;
      LAN: 2*RJ45 LAN Gigabit Ethernet Controller, Realtek 81;
      USB Port: 4*USB 3.0 Port,4*USB 2.0 Port;
      Memory Types: 2*DDR4 So-DIMM 260 Pin;
      Max Memory Size: 64GB;
      Processor Graphics: Intel UHD Graphics;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som+ Carrier Board;
      Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
      OS: Android 14;
      GPU: Arm Mali-G52 Mc3;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3588s, Octa Core 2.4GHz 8nm 6tops;
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3588s, Octa Core 2.4GHz 8nm 6tops;
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Supplier Name

      Shenzhen Fannis Technology Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

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