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      Custom PCB
      US$1.00-4.00 / Piece
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      What is Custom Multi-Layer Fr-4 PCB Manufacturing Services for Electronics Components Device

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9 Pieces US$4.00

      10-999 Pieces US$3.00

      1,000-9,999 Pieces US$2.00

      10,000+ Pieces US$1.00

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Complex
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Model PCB
      • Brand OEM
      • Transport Package Carton Box
      • Specification 200 PCS/CTN
      • Trademark Customer's brand
      • Origin China
      • Test Aoi/Spi/X-ray
      • Certification ISO/RoHS/IATF/UL
      • Packing Carton/Plastic/Vacuum
      • Delivery 7-15 Days Sample

      Product Description

      About us Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional IEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the company ...

      Learn More

      Custom PCB Comparison
      Transaction Info
      Price US$1.00-4.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Product Certification ISO/RoHS/IATF/UL - - - -
      Management System Certification Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Complex;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Model: PCB;
      Brand: OEM;
      Test: Aoi/Spi/X-ray;
      Packing: Carton/Plastic/Vacuum;
      Delivery: 7-15 Days Sample;
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°C;
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°C;
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°C;
      Type: Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Material: Customized;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: FR-4;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: Aluminum 5052 Core (1.2mm);
      Thermal Conductivity: 2W/M·K (Dielectric Layer);
      Copper Foil: 70/70μm;
      Tg: 130°C;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier