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      PCB
      US$0.05-1.96 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      10-99 Pieces US$1.96

      100-999 Pieces US$1.29

      1,000-9,999 Pieces US$1.08

      10,000+ Pieces US$0.05

      Sepcifications

      • Type Combining Rigid Circuit Board
      • Flame Retardant Properties V0
      • Dielectric FR-4
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Processing Technology Surface Mounted Technolgoy
      • Application Consumer Electronics
      • Mechanical Rigid Fexible
      • Material Paper Phenolic Copper Foil Substrate
      • Brand Jxpcba
      • Transport Package Air Bubble Film
      • Specification Custom
      • Trademark JXpcba
      • Origin China
      • PCBA Material Fr4, High Tg, Halogen-Free, High Frequency
      • Surface Treatment HASL/Immersion Gold/Immersion Silver/Immersion Tin
      • Certificate ISO9001/ISO14001/CE/RoHS
      • PCB Solder Mask White, Black, Yellow, Green, Red, Blue
      • Component Packing Tary, Tube, Tape
      • Number of Layer 1-32
      • Minimum Line Width/Spacing 3.0mil
      • Maximum Plate Thickness Aperture Ratio 30:1
      • Minimum Mechanical Drilling Aperture 6mil
      • Board Thickness 0.2mm~6.0mm
      • Maximum Board Size 640mm*1100mm
      • PCBA Test Static Test, Power-on Function Test, Power-on Agin
      • PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop
      • PCBA Testing Service Aoi, Ict, X-ray, Flying Probe Test
      • Product Application Consumer Electronics/Home Appliances/Medical Equip

      Product Description

      Product Parameters Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: 0.5-5oz ...

      Learn More

      PCB Comparison
      Transaction Info
      Price US$0.05-1.96 / Piece US$0.10-1.50 / Piece US$0.10 / Piece US$0.10-1.50 / Piece US$0.10-1.50 / Piece
      Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram T/T T/T
      Quality Control
      Product Certification ISO9001/ISO14001/CE/RoHS - UL, RoHS, SGS, ISO 9001, Ect - -
      Management System Certification Others ISO9001:2015, ISO14001, Others - ISO9001:2015, ISO14001, Others ISO9001:2015, ISO14001, Others
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM Own Brand, ODM, OEM - Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Dielectric: FR-4;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Surface Mounted Technolgoy;
      Application: Consumer Electronics;
      Mechanical Rigid: Fexible;
      Material: Paper Phenolic Copper Foil Substrate;
      Brand: Jxpcba;
      PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
      Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
      PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
      Component Packing: Tary, Tube, Tape;
      Number of Layer: 1-32;
      Minimum Line Width/Spacing: 3.0mil;
      Maximum Plate Thickness Aperture Ratio: 30:1;
      Minimum Mechanical Drilling Aperture: 6mil;
      Board Thickness: 0.2mm~6.0mm;
      Maximum Board Size: 640mm*1100mm;
      PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
      Product Application: Consumer Electronics/Home Appliances/Medical Equip;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Dielectric: FR-4;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Processing Technology: Electrolytic Foil;
      Application: Consumer Electronics;
      Mechanical Rigid: Rigid;
      Material: Paper Phenolic Copper Foil Substrate;
      Brand: Kevis;
      Layer: 1-64 Layers;
      Board Thickness: 0.2mm-7.0mm;
      Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
      Min. Hole Size: 0.15mm;
      Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
      Solder Mask Color: Green, Blue, Yellow, White, Black;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Dielectric: FR-4;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Processing Technology: Electrolytic Foil;
      Application: Consumer Electronics;
      Mechanical Rigid: Rigid;
      Material: Paper Phenolic Copper Foil Substrate;
      Silkscreen: White, Black, Red;
      Solder Mask: Green, Yellow, Red, White, Black, Blue;
      Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
      Board Thickness: 0.2-4.0mm;
      Copper Thickness: 1oz to 5 Oz;
      Min Hole Size: 0.2mm;
      Min Line Width: 0.15mm;
      Min Line Spacing: 0.15mm;
      Layer: 1 to 18;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Dielectric: FR-4;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Processing Technology: Electrolytic Foil;
      Application: Consumer Electronics;
      Mechanical Rigid: Rigid;
      Material: Paper Phenolic Copper Foil Substrate;
      Brand: Kevis;
      Layer: 1-64 Layers;
      Board Thickness: 0.2mm-7.0mm;
      Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
      Min. Hole Size: 0.15mm;
      Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
      Solder Mask Color: Green, Blue, Yellow, White, Black;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Dielectric: FR-4;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Processing Technology: Electrolytic Foil;
      Application: Consumer Electronics;
      Mechanical Rigid: Rigid;
      Material: Paper Phenolic Copper Foil Substrate;
      Brand: Kevis;
      Layer: 1-64 Layers;
      Board Thickness: 0.2mm-7.0mm;
      Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
      Min. Hole Size: 0.15mm;
      Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
      Solder Mask Color: Green, Blue, Yellow, White, Black;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier