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      Multilayer
      US$3.20 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      10 Pieces US$3.20 / Piece

      Sepcifications

      • Type Combining Rigid Circuit Board
      • Flame Retardant Properties V2
      • Dielectric FR-4
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Processing Technology Surface Mounted Technolgoy
      • Application Medical Instruments
      • Mechanical Rigid Rigid
      • Material Paper Phenolic Copper Foil Substrate
      • Brand Jx
      • Transport Package Air Bubble Film+Carton
      • Specification Custom
      • Trademark JX
      • Origin China
      • MOQ at Least 1PCS
      • Delivery Term Fob
      • Payment Term by T/T in Advance
      • Leadtime 20days After Get Your Deposit

      Product Description

      Shenzhen Jingxin Electronic Technology Co.,Ltd. Built since 2002, is a almost 20 years professional company dedicating to PCBA industry. Our factory located in Shenzhen, and have dust-free workship which cover an area of over than 10000m², almost 600 employees, more than 30 production lines ...

      Learn More

      Multilayer Comparison
      Transaction Info
      Price US$3.20 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Management System Certification Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: V2;
      Dielectric: FR-4;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Surface Mounted Technolgoy;
      Application: Medical Instruments;
      Mechanical Rigid: Rigid;
      Material: Paper Phenolic Copper Foil Substrate;
      Brand: Jx;
      MOQ: at Least 1PCS;
      Delivery Term: Fob;
      Payment Term: by T/T in Advance;
      Leadtime: 20days After Get Your Deposit;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.5mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.5mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.5mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.5mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 70μm;
      Tg: 150°C;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

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