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      Electronic Component
      US$1.50-4.50 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      10-499 Pieces US$4.50

      500-999 Pieces US$4.00

      1,000-4,999 Pieces US$3.50

      5,000+ Pieces US$1.50

      Sepcifications

      • Structure Multilayer Rigid PCB
      • Dielectric FR-4
      • Material Epoxide Woven Glass Fabric Laminate
      • Application Consumer Electronics
      • Flame Retardant Properties HB
      • Processing Technology Electrolytic Foil
      • Production Process Subtractive Process
      • Base Material Aluminum
      • Insulation Materials Epoxy Resin
      • Brand Jxpcba
      • Transport Package ESD Bag+Bubble Wrapped +Carton
      • Specification customized PCBA
      • Trademark jxpcba
      • Origin China
      • Layer 1-32 Layers
      • Board Thickness 0.2-8.0mm
      • PCBA Testing PCB: Ict Testing and Flying Probe Testing, PCBA: a
      • PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop
      • Qualified Ipc-a-610cclass 2 Standard
      • Thick Copper 18um-140um(4oz)
      • Service OEM/ODM, EMS

      Product Description

      Our Service PCB assembly OEM service Electronic components material purchasing Bare PCB fabrication PCB Assembly Service. (SMT, BGA, DIP) FULL Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT) Cable, Wire-harness assembly,sheet metal,Electrical cabinet Assembly service Conformal ...

      Learn More

      Electronic Component Comparison
      Transaction Info
      Price US$1.50-4.50 / Piece US$0.99 / PCS US$0.99 / PCS US$0.99 / PCS US$0.99 / PCS
      Min Order 10 Pieces 1 PCS 1 PCS 1 PCS 1 PCS
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC
      Quality Control
      Management System Certification Others - - - -
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Product Attributes
      Specification
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxide Woven Glass Fabric Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: HB;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      Layer: 1-32 Layers;
      Board Thickness: 0.2-8.0mm;
      PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      Qualified: Ipc-a-610cclass 2 Standard;
      Thick Copper: 18um-140um(4oz);
      Service: OEM/ODM, EMS;
      Structure: Multilayer Rigid PCB;
      Dielectric: Clte Laminate;
      Material: PTFE-Based Laminates;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Rogers;
      Copper Weight: 0.5oz, 1oz or 2 Oz;
      Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
      Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
      Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
      Structure: Multilayer Rigid PCB;
      Dielectric: F4btm300 Laminate;
      Material: Fiberglass Cloth, Nano-Ceramic Fillers, and PTFE;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Wangling;
      Copper Weight: 0.5oz, 1oz or 2 Oz;
      Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
      Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
      Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
      Structure: Multilayer Rigid PCB;
      Dielectric: F4btme300 Laminate;
      Material: Fiberglass Cloth, Nano-Ceramic Fillers, and PTFE;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Wangling;
      Copper Weight: 0.5oz, 1oz or 2 Oz;
      Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
      Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
      Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
      Structure: Multilayer Rigid PCB;
      Dielectric: RO3003 Laminate;
      Material: Ceramic Filled PTFE Composites;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Rogers;
      Copper Weight: 0.5oz, 1oz or 2 Oz;
      Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
      Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
      Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier