| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
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Structure: Multilayer Rigid PCB;
Dielectric: Clte Laminate;
Material: PTFE-Based Laminates;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Copper Weight: 0.5oz, 1oz or 2 Oz;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
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Structure: Multilayer Rigid PCB;
Dielectric: F4btm300 Laminate;
Material: Fiberglass Cloth, Nano-Ceramic Fillers, and PTFE;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Wangling;
Copper Weight: 0.5oz, 1oz or 2 Oz;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
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Structure: Multilayer Rigid PCB;
Dielectric: F4btme300 Laminate;
Material: Fiberglass Cloth, Nano-Ceramic Fillers, and PTFE;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Wangling;
Copper Weight: 0.5oz, 1oz or 2 Oz;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
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Structure: Multilayer Rigid PCB;
Dielectric: RO3003 Laminate;
Material: Ceramic Filled PTFE Composites;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Copper Weight: 0.5oz, 1oz or 2 Oz;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
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