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Die Bonding Machine

US$50,000.00-99,999.00 / Piece

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What is Semiconductor Chip Packaging Equipment High Precision COB Smart Eutectic Crystal Planting Die Bonding Machine with Automatic Dispensing System

Name: Semiconductor Chip Packaging Equipment High Precision COB Smart Eutectic Crystal Planting Die Bonding Machine with Automatic Dispensing System
Uploaded: 2026-02-10T06:40:56+08:00
Description: Since 2014,One-stop Professional Solution for Semiconductor Front-end and IC TO Package Equipments Line Automatic die bonder for Semiconductor industry IC package MD-JC360-D MD-JC380-D MD-JC360 MD-JC3

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$50,000.00-99,999.00 / Piece

Sepcifications

After-sales Service 1 Year
Condition New
Speed High Speed
Precision Precision
Certification CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crate
Trademark minder-hightech
Origin China

Product Description

Since 2014,One-stop Professional Solution for Semiconductor Front-end and IC TO Package Equipments Line Automatic die bonder for Semiconductor industry IC package MD-JC360-D MD-JC380-D MD-JC360 MD-JC380 MD-JC360i MD-JC380i MDAX64DI MD-1412 Automatic loading and unloading die bonder Fully automatic ...

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Guangzhou Minder-Hightech co.,Ltd

Diamond Member Since 2017

Audited Supplier

Main Products Wire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, ...
Year of Establishment 2014-12-30
Address Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital 1,000,000 RMB
Main Markets North America, Europe
International Commercial Terms(Incoterms) EXW

Die Bonding Machine Comparison

	Semiconductor Chip Packaging Equipment High Precision COB Smart Eutectic Crystal Planting Die Bonding Machine with Automatic Dispensing System Contact Now	Quick View Mini LED High-Speed LED Die Bonder Semiconductor Packaging Equipment for Semiconductor Electronic Product Manufacturing Contact Now	Quick View High-Performance Lx-8 Pick-and-Place Machines at Competitive Price Juki Machines Contact Now	Quick View Juki Jled Assembly Machine SMD Pick and Place Chip Mounter Contact Now	Quick View SMT Placement Machine, LED Pick and Place Machine, Chip Mounter Juki Lx-8 Contact Now

Transaction Info
	Semiconductor Chip Packaging Equipment High Precision COB Smart Eutectic Crystal Planting Die Bonding Machine with Automatic Dispensing System Contact Now	Quick View Mini LED High-Speed LED Die Bonder Semiconductor Packaging Equipment for Semiconductor Electronic Product Manufacturing Contact Now	Quick View High-Performance Lx-8 Pick-and-Place Machines at Competitive Price Juki Machines Contact Now	Quick View Juki Jled Assembly Machine SMD Pick and Place Chip Mounter Contact Now	Quick View SMT Placement Machine, LED Pick and Place Machine, Chip Mounter Juki Lx-8 Contact Now
Price	US$50,000.00-99,999.00 / Piece	US$20,000.00 / Piece	US$120,000.00 / Piece	US$120,000.00 / Piece	US$120,000.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T	-	T/T, D/P, PayPal, Western Union, LC	T/T, D/P, PayPal, Western Union, LC	T/T, D/P, PayPal, Western Union, LC
Quality Control
Product Certification	CE	CE	CE	CE	CE
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month
Product Attributes
Specification	After-sales Service: 1 Year; Condition: New; Speed: High Speed; Precision: Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter;	Condition: Used; Speed: Medium Speed; Precision: High Precision; Warranty: 6 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: LED High-Speed Die Bonder; Model: LED High-Speed Die Bonder; Application: Semiconductor Packaging; Placement Speed: 40000;	After-sales Service: Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Maximum: 5mm; Minimum: 0201/03015; Component Height: 3mm/25mm; Lx-8: High;	After-sales Service: Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Maximum: 5mm; Minimum: 0201/03015; Component Height: 3mm/25mm; Lx-8: High;	After-sales Service: Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Maximum: 5mm; Minimum: 0201/03015; Component Height: 3mm/25mm; Lx-8: High;
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