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      Electronics Component
      US$0.50-1.00 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      10-49 Pieces US$1.00

      50-99 Pieces US$0.80

      100-499 Pieces US$0.70

      500-999 Pieces US$0.60

      1,000+ Pieces US$0.50

      Sepcifications

      • Metal Coating Copper
      • Mode of Production SMT
      • Layers Multilayer
      • Base Material FR-4
      • Certification RoHS, CCC, ISO
      • Customized Customized
      • Condition New
      • Transport Package Carton
      • Specification unlimited
      • Trademark Mustar
      • Origin Shenzhen
      • Shape DIP
      • Conductive Type Bipolar Integrated Circuit
      • Integration Gsi
      • Technics Semiconductor IC
      • D/C Standard
      • Warranty 2 Years
      • Mounting Type Standard, SMT, DIP
      • Cross Reference Standard
      • Memory Type Standard

      Product Description

      Welcome to Mu Star (Shenzhen) Industry Co., LTD Our Advantages 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test. 3. Professional service: PCB Layout, PCB/FPC/Aluminium Making, SMT, DIP, Component ...

      Learn More

      Electronics Component Comparison
      Transaction Info
      Price US$0.50-1.00 / Piece US$2.40 / Piece US$8.21-13.00 / Piece US$0.65-5.00 / Piece US$1.00-5.00 / Piece
      Min Order 10 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T T/T T/T
      Quality Control
      Product Certification RoHS, CCC, ISO RoHS, CCC, ISO ISO RoHS, CCC, ISO RoHS, CCC, ISO
      Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
      Trade Capacity
      Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Domestic Domestic Domestic Domestic
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Shape: DIP;
      Conductive Type: Bipolar Integrated Circuit;
      Integration: Gsi;
      Technics: Semiconductor IC;
      D/C: Standard;
      Warranty: 2 Years;
      Mounting Type: Standard, SMT, DIP;
      Cross Reference: Standard;
      Memory Type: Standard;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: Used;
      Product Name: Multilayer PCBA Design Printed Printing for Elect;
      Shipment Way: by Air by Sea;
      Payment Way: Tt;
      Min.Pin Space of IC: 0.3mm;
      Min. Space of BGA: +/- 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Electronic: 100kmonth;
      Test&#160;: 100% Aoi Testing;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-6;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Customized;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Supplier Name

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier