| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: DC Inverter Heat Pump Control Board;
Application: Household Heat Pump Water Heater;
Power Supply: 220VAC/50Hz;
Sensor Type: Ntc;
Control Mode: Cooling, Heating, Dhw and Floor Heating;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: DC Inverter Heat Pump Control Board;
Application: Household Heat Pump Water Heater;
Power Supply: 380VAC/50Hz;
Sensor Type: Ntc;
Control Mode: Cooling, Heating, Dhw and Floor Heating;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model No.: CT1K2 Vml;
Rated Input Voltage: 208/ 220/ 230/ 240VAC(50/ 60Hz);
Output Format: L+N+PE;
PV Charging Method: MPPT;
PV Max Input Power: 1000W;
PV Max Input Current: 14A;
Product Weight (Kg): 1.5;
Dimensions (mm): 302×203×62;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1~28 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr-4;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.2mm;
Processing Technology: Electrolytic Foil;
Other Service: ODM, OEM, Final Product Assembling;
Insulation Materials: Organic Resin;
Application: Consumer Electronics, Communications, Aerospace;
PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
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