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      4 Channels Bluetooth Relay Module Remote Control Switch Compatible Ios Android 4.3 12V OEM Manufacturer PCBA

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$10.00

      100-999 Pieces US$0.80

      1,000-9,999 Pieces US$0.60

      10,000+ Pieces US$0.02

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy Resin + Polyimide Resin
      • Application Consumer Electronics
      • Flame Retardant Properties V2
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand New Chip
      • Transport Package Foam Packing
      • Specification FR4 1-4 Layers
      • Trademark New Chip
      • Origin China
      • Capacity 1000000
      • OEM/ODM Available
      • Sample Available
      • Surface Treatment OSP, Enig, HASL, AG Immersion
      • Certificate Gurantee Yes
      • Test 100%E-Testing
      • Min Bonding Pad Diameter 10mil
      • Min Thickness of Soldermask 10um
      • Color of Silk-Screen White, Yellow, Black
      • Data File Format Gerber File and Drilling File, Protel Series,...
      • Material for PCB Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari
      • Layer Count 1-20 Layers
      • Shipping DHL/UPS/FedEx/Air/Sea

      Product Description

      Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

      Learn More

      PCBA Manufacturing Comparison
      Transaction Info
      Price US$0.02-10.00 / Piece US$4.21-5.72 / Piece US$4.26-6.33 / Piece US$5.20-6.99 / Piece US$4.13-6.74 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series,...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Material: Fr4, Rogers;
      Board Layer: 1-26;
      Board Thickness: 0.8mm-3.0mm;
      Copper Thickness: 0.5 Oz-6 Oz;
      Max PCB Size: 650*650mm;
      Min Hole: 0.15mm;
      Min Trace: 0.15mm;
      Surface Finishing: HASL-Lf;
      Solder Mask: Any;
      Lead Time: 4-5 Working Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Material: Fr4, Rogers;
      Board Layer: 1-26;
      Board Thickness: 0.8mm-3.0mm;
      Copper Thickness: 0.5 Oz-6 Oz;
      Max PCB Size: 650*650mm;
      Min Hole: 0.15mm;
      Min Trace: 0.15mm;
      Surface Finishing: HASL-Lf;
      Solder Mask: Any;
      Lead Time: 4-5 Working Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Material: Fr4, Rogers;
      Board Layer: 1-26;
      Board Thickness: 0.8mm-3.0mm;
      Copper Thickness: 0.5 Oz-6 Oz;
      Max PCB Size: 650*650mm;
      Min Hole: 0.15mm;
      Min Trace: 0.15mm;
      Surface Finishing: HASL-Lf;
      Solder Mask: Any;
      Lead Time: 4-5 Working Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Material: Fr4, Rogers;
      Board Layer: 1-26;
      Board Thickness: 0.8mm-3.0mm;
      Copper Thickness: 0.5 Oz-6 Oz;
      Max PCB Size: 650*650mm;
      Min Hole: 0.15mm;
      Min Trace: 0.15mm;
      Surface Finishing: HASL-Lf;
      Solder Mask: Any;
      Lead Time: 4-5 Working Days;
      Supplier Name

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

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