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      Android Development Board
      US$56.90-60.60 / Piece
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      What is Rockchip Rk3568 Quad-Core Dual Screen Embedded Industrial Open Source Development Board

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      2 Pieces US$56.90-60.60 / Piece

      Sepcifications

      • Integrated Graphics Integrated Graphics
      • Main Chipset Rockchip
      • Maximum Memory Capacity 8G
      • Structure ATX
      • Memory DDR2
      • SATA Interface SATA3.0
      • CPU Socket LGA 775
      • Printed Circuit Board Six Layer
      • Main Board Structure Integrated
      • Audio Effects HiFi
      • Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
      • Specification Customized
      • Trademark customized
      • Origin Shenzhen, China
      • Name PCBA Assembly Manufacturing
      • Inspection 100% IQC, Ipqc, Fqc, QA, Ict
      • Advantages PCB Design/Assembly, PCBA & EMS
      • Good Services SMT, BGA and DIP
      • Production Type SMT & DIP & Assembling & Testing
      • Certificate UL94V-0+RoHS
      • Services OEM&ODM Manufacturer Since 2005
      • Item Control Board PCBA

      Product Description

      Product Description Rockchip RK3568 Quad-core Dual Screen Embedded Industrial Open Source Development Board System CPU Rockchip RK3568,ARM 4Core A55,UP to 2.0GHz GPU Mali-G52 2EE NPU Support 1Tops Computing power RAM With Standard 2GB/4GB/8GB LPDDR4 R0M With Standard ...

      Learn More

      Android Development Board Comparison
      Transaction Info
      Price US$56.90-60.60 / Piece US$70.00-200.00 / Piece US$60.00-350.00 / Piece US$31.00-100.00 / Piece US$14.00-24.00 / Piece
      Min Order 2 Pieces 5 Pieces 5 Pieces 10 Pieces 10 Pieces
      Payment Terms T/T T/T, PayPal T/T, PayPal LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Product Certification UL94V-0+RoHS - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Rockchip;
      Maximum Memory Capacity: 8G;
      Structure: ATX;
      Memory: DDR2;
      SATA Interface: SATA3.0;
      CPU Socket: LGA 775;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Audio Effects: HiFi;
      Name: PCBA Assembly Manufacturing;
      Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
      Advantages: PCB Design/Assembly, PCBA & EMS;
      Good Services: SMT, BGA and DIP;
      Production Type: SMT & DIP & Assembling & Testing;
      Services: OEM&ODM Manufacturer Since 2005;
      Item: Control Board PCBA;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 32G;
      Structure: Mini ATX;
      Memory: DDR4;
      SATA Interface: SATA3.0;
      CPU Socket: Standard;
      Printed Circuit Board: Six Layer;
      Main Board Structure: CPU Based;
      Audio Effects: HiFi;
      Processor1: N100,Alder Lake-N and Twin Lake;
      RAM: 1*DDR4,up to 32GB;
      Display: VGA/ Dp, HDMI, Lvds/Edp1, Edp2;
      LAN1: 2*Realtek Gigabit Ethernet;
      Strorage: 1*M.2 Key-M 2280 Pcie/SATA SSD;
      Audio: Alc897 7.1-Channel;
      Extension 1: 1*Mini-Pcie Slot (4G/Msata/WiFi);
      Extension 2: 1*M.2 Key-E ( Wi-Fi/Bluetooth);
      USB: 9*USB , Including 4*USB 3.0;
      COM: 6*RS232 , Default 2*RS485;
      Power Supply: DC 12V;
      Temp.: Working:-10℃-60℃;Storage:-20℃-70;
      Working Humidity: 5%-95% Relative Humidity,No-Condensing;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 64G;
      Structure: Mini ATX;
      Memory: DDR4;
      SATA Interface: SATA3.0;
      CPU Socket: Standard;
      Printed Circuit Board: Six Layer;
      Main Board Structure: CPU Based;
      Audio Effects: HiFi;
      Processor1: 12th/13th/14th Gen LGA1700 Celeron/Pentium/Core™;
      RAM: 2*DDR4,up to 64GB;
      Display: VGA/Dp, Lvds/ Edp, HDMI/Dual HDMI Interfaces;
      LAN1: 2*Realtek Gigabit Ethernet;
      Strorage: 1*M.2 Key-M Nvme or SATA Adaptive SSD;
      Audio: Alc897;
      Extension 1: 1*Mini-Pcie Slot (4G/Msata/WiFi);
      Extension 2: 1*Mini-Pcie Slot (USB Wi-Fi/5g );
      USB: 9*USB , Including 4*USB 3.0;
      COM: 6*RS232 , Default4*RS485;
      Power Supply: DC 12V;
      Temp.: Working:-10℃-60℃;Storage:-20℃-70;
      Working Humidity: 5%-95% Relative Humidity,No-Condensing;
      Integrated Graphics: Not Integrated Graphics;
      Main Chipset: AMD;
      Maximum Memory Capacity: 64G;
      Structure: Micro ATX;
      Memory: 2*DDR4;
      SATA Interface: SATA3.0;
      CPU Socket: LGA1331;
      Printed Circuit Board: Double Layers;
      Main Board Structure: Integrated;
      Audio Effects: Audio;
      OEM/ODM: Support;
      Chipset: AMD B450 Chipset;
      Support System: Windows 11, Windows 10;
      BIOS: Uefi Ami BIOS;
      Storage 1: 4*SATA3.0 Port 6GB/S;
      Storage 2: 1*M.2_SSD( M Key Nvme 2242/2260/2280);
      Display: 1*VGA Port / 1*HDMI Port;
      DDR4: 2*DDR4 2133/2400/2666/2933/3200 DIMM Max 64GB;
      Expansion Slots: 1*Pcie3.0 X16 Slot/1*Pcie3.0 X1 Slot;
      Audio: Support Realtek Alc897 High Fidelity Audio;
      Integrated Graphics: Not Integrated Graphics;
      Main Chipset: nVidia;
      Maximum Memory Capacity: 4G;
      Structure: Nvidia Gt730;
      Memory: DDR3;
      SATA Interface: No SATA;
      CPU Socket: No CPU;
      Printed Circuit Board: Double Layers;
      Main Board Structure: Discrete Graphics;
      Audio Effects: No;
      Chipset: Nvidia Gt730;
      Bus Interface: Pcie 2.0 X16;
      Video Memory: 4GB DDR3;
      Memory Interface: 128bit;
      Engine Clock: 700MHz;
      Stream Processors: 1333MHz;
      Dpi: HDMI™ 2.0b;
      Connectors: 1×HDMI 2.0+DVI+Dp;
      Supplier Name

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Sy Smartlink Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Sy Smartlink Technology Co., Ltd.

      Diamond Member Audited Supplier

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