Aluminum PCB

US$0.01-0.41 / Piece

94V0 Circuit Board Control Board IC Components Board Assembly PCBA pictures & photos

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What is 94V0 Circuit Board Control Board IC Components Board Assembly PCBA

Name: 94V0 Circuit Board Control Board IC Components Board Assembly PCBA
Uploaded: 2026-02-23T21:45:59+08:00
Description: Technical Capabilities Items Speci. Remark Max panel size 32" x 20.5"(800mm x 520mm) Max. Board size 2000×610mm Min. board Thickness 2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-laye

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Price

Min. Order Reference FOB Price

1 Piece US$0.01-0.41 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric CEM-3
Material Polyester Glass Fiber Mat Laminate
Application Aerospace
Flame Retardant Properties V2
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Aluminum
Insulation Materials Organic Resin
Brand Okey
Transport Package Inner Vacuum Packing and Outer by Cartons
Specification FR4, 1.6mm, multiLayer, 1OZ Copper Thickness
Trademark OKEY
Origin Guangdong Shenzhen, China
Shape Retangular, Round, Slots, Cutouts, Complex, Irreg
Surface Finishing OSP, Immersion Gold, Immersion Tin, Immersion AG
Layer 1-60 Layers
Service Turnkey Assembly PCB Service
Other Capabilities Repair/Rework Services Mechanical Assembly Box Bui
Copper Thickness 1-10oz
Min. SMD Size 01005
QA Inspection QA Inspection and Ect.
Certificate ISO9001, ISO14000, Ts16949.UL.RoHS
Order Qty No Limited
Controlling Range -40c~125c
Solder Resist Color Green;Red;Yellow;Black;White and Ect.
Surface Finishedc HASL, Gold Finger, OSP, Enig, Peelable Mask
Trade Mark OEM, ODM
Conditions New

Product Description

Technical Capabilities Items Speci. Remark Max panel size 32" x 20.5"(800mm x 520mm) Max. Board size 2000×610mm Min. board Thickness 2-layer 0.15mm 4-layer 0.4mm 6-layer 0.6mm 8-layer 1.5mm 10-layer 1.6~2.0mm Min. line Width/Space 0.1mm(4mil) Max. ...

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Shenzhen Okey Circuit Co., Ltd.

Diamond Member Since 2013

Audited Supplier

Main Products PCB, PCB Board, Circuit Board, Printed Circuit Board, PCB Assembly, PCB Manufactory, ...
Address 1 Floor, 2#Gong Ye Yi Road, Dawangshan, Shajing, Bao'an District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF
Terms of Payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

Aluminum PCB Comparison

	94V0 Circuit Board Control Board IC Components Board Assembly PCBA Contact Now	Quick View Hds Live 9 Controller of Lowrance Fish Finder Contact Now	Quick View Hds Live 12 Processor of Lowrance Fish Finder Contact Now	Quick View Hds Gen 3 Touch 12 Main Board of Lowrance Fish Finder Contact Now	Custom Multilayer PCB Wholesale Printed Circuit Board with Immersion Gold China Rigid PCB Contact Now

Transaction Info
	94V0 Circuit Board Control Board IC Components Board Assembly PCBA Contact Now	Quick View Hds Live 9 Controller of Lowrance Fish Finder Contact Now	Quick View Hds Live 12 Processor of Lowrance Fish Finder Contact Now	Quick View Hds Gen 3 Touch 12 Main Board of Lowrance Fish Finder Contact Now	Custom Multilayer PCB Wholesale Printed Circuit Board with Immersion Gold China Rigid PCB Contact Now
Price	US$0.01-0.41 / Piece	US$99.00-199.00 / Piece	US$99.00-199.00 / Piece	US$99.00-199.00 / Piece	US$0.01-100.00 / Piece
Min Order	1 Piece	10 Pieces	10 Pieces	10 Pieces	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	ISO9001, ISO14000, Ts16949.UL.RoHS	-	-	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: CEM-3; Material: Polyester Glass Fiber Mat Laminate; Application: Aerospace; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Okey; Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg; Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG; Layer: 1-60 Layers; Service: Turnkey Assembly PCB Service; Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui; Copper Thickness: 1-10oz; Min. SMD Size: 01005; QA Inspection: QA Inspection and Ect.; Order Qty: No Limited; Controlling Range: -40c~125c; Solder Resist Color: Green;Red;Yellow;Black;White and Ect.; Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask; Trade Mark: OEM, ODM; Conditions: New;	Structure: Metal Base Rigid PCB; Dielectric: FR-1; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Aluminum; Insulation Materials: Metal Composite Materials; Brand: Head Sun; Machine No. 1: Hds Live 7; Machine No. 2: Hds Live 9; Machine No. 3: Hds Live 12; Machine No. 4: Hds Live 16; Machine No. 5: Hds PRO 16; Machine No. 6: Hds-7 Carbon; Machine No. 7: Hds-9 Carbon; Machine No. 8: Hds-12 Carbon; Machine No. 9: Hds-16 Carbon; Machine No. 10: Hds 9 Gen 2 Touch; Machine No. 11: Hds 9 Gen 3 Touch; Machine No. 12: Hds 12 Gen 2 Touch; Machine No. 13: Hds 12 Gen 3 Touch; Machine No. 14: Hds 8 Insight USA; Machine No. 15: Hds-8;	Structure: Metal Base Rigid PCB; Dielectric: FR-1; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Aluminum; Insulation Materials: Metal Composite Materials; Brand: Head Sun; Machine No. 1: Hds Live 7; Machine No. 2: Hds Live 9; Machine No. 3: Hds Live 12; Machine No. 4: Hds Live 16; Machine No. 5: Hds PRO 16; Machine No. 6: Hds-7 Carbon; Machine No. 7: Hds-9 Carbon; Machine No. 8: Hds-12 Carbon; Machine No. 9: Hds-16 Carbon; Machine No. 10: Hds 9 Gen 2 Touch; Machine No. 11: Hds 9 Gen 3 Touch; Machine No. 12: Hds 12 Gen 2 Touch; Machine No. 13: Hds 12 Gen 3 Touch; Machine No. 14: Hds 8 Insight USA; Machine No. 15: Hds-8;	Structure: Metal Base Rigid PCB; Dielectric: FR-1; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Aluminum; Insulation Materials: Metal Composite Materials; Brand: Head Sun; Machine No. 1: Hds Live 7; Machine No. 2: Hds Live 9; Machine No. 3: Hds Live 12; Machine No. 4: Hds Live 16; Machine No. 5: Hds PRO 16; Machine No. 6: Hds-7 Carbon; Machine No. 7: Hds-9 Carbon; Machine No. 8: Hds-12 Carbon; Machine No. 9: Hds-16 Carbon; Machine No. 10: Hds 9 Gen 2 Touch; Machine No. 11: Hds 9 Gen 3 Touch; Machine No. 12: Hds 12 Gen 2 Touch; Machine No. 13: Hds 12 Gen 3 Touch; Machine No. 14: Hds 8 Insight USA; Machine No. 15: Hds-8;	Structure: Flush Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper ,PP; Insulation Materials: Epoxy Resin; Brand: Kb,Shenyi,Rogers,Iteq; Layer: 1-40 Layers; Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.; Board Thickness: 0.20mm-8.00mm; Board Outline Tolerance: +0.10mm; Minimum Line/Space: 0.075mm; Impedance Control Tolerance: +/-10%; Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
Supplier Name	Shenzhen Okey Circuit Co., Ltd.	Head Sun Co., Ltd.	Head Sun Co., Ltd.	Head Sun Co., Ltd.	Abis Circuits Co., Ltd.
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