| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-5;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Yuehong;
Function: VGA+Cga;
Screen Forward: Vertical;
Warranty: Lifetime Technical Support;
Features: 2800 Games Optional;
Gross Weight: 0.3kg;
Service: OEM/ODM;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
MOQ: 1 PCS;
Min. Line Spacing: 0.075mm(3mil);
Copper Thickness: 18um-3500um(0.5- 100oz);
Min. Line Width: 0.075mm(3mil);
Min Hole Size: 0.1mm(4mil);
Testing Service: 100% E-Testing;
Board Thickness: 0.2-6.0mm;
Industrial: Industrial Control Board, Motherboard;
Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger, OSP;
Solder Mask: Green, White, Black, Blue, Red(Customized);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
MOQ: 1 PCS;
Min. Line Spacing: 0.075mm(3mil);
Copper Thickness: 18um-3500um(0.5- 100oz);
Min. Line Width: 0.075mm(3mil);
Min Hole Size: 0.1mm(4mil);
Testing Service: 100% E-Testing;
Board Thickness: 0.2-6.0mm;
Industrial: Industrial Control Board, Motherboard;
Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger, OSP;
Solder Mask: Green, White, Black, Blue, Red(Customized);
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Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: EEG;
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