| Specification |
Application Field: Industrial Control;
Processor Type: Intel;
CPU: Integrated Intel 6th Mobile Single Chipset CPU;
USB: 4*USB3.0 and 6* USB 2.0;
COM: 4*RS-232, 2*RS422/485 Optional;
Operating System: Win10 & Linux;
Size: 236*185*85mm;
RAM: Dual Channel 2 *DDR4 2133MHz SODIMM 260 Socket;
LAN: Single LAN or 2*Intel I211at for Optional;
|
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som+ Carrier Board;
Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
OS: Android 14;
GPU: Arm Mali-G52 Mc3;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
|
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som;
Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
OS: Android 14;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
|
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som;
Processor: Rockchip Rk3588s, Octa Core 2.4GHz 8nm 6tops;
OS: Android 14;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
|
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som;
Processor: Rockchip Rk3588s, Octa Core 2.4GHz 8nm 6tops;
OS: Android 14;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
|
