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      Rigid-Flex PCB Assembly
      US$5.00-500.00 / Piece
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      What is Multilayer Rigid-Flex PCB Assembly with High Impedance Control Accuracy

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$5.00-500.00 / Piece

      Sepcifications

      • Insulation Materials Organic Resin
      • Flame Retardant Properties HB
      • Application Aerospace
      • Transport Package ESD Bag, Carton Box
      • Specification Customized
      • Trademark Customized
      • Origin China
      • Product Name High Complexity PCBA
      • Service PCB+Assembly+Components
      • Testing Service Electrical Testing, Flying Probe Tester, Functiona
      • Value-Added Services Bom Analysis, Conformal Coating, IC Programming
      • Technical Support Free Dfm/a Check, Bom Analysis
      • Placement Precision ±0.03mm / ±0.01mm (Chip)

      Product Description

      Workshop Introduction Product Description High Complexity PCB Assembly PCBA Specification Turnkey Service PCB Design + PCB FAB + Component Sourcing + PCBA + Box Building + Packaging Value-Added Services BOM Analysis, Conformal Coating, IC Programming, Wire Harness &Cable Assembly, Ageing &Testing ...

      Learn More

      Rigid-Flex PCB Assembly Comparison
      Transaction Info
      Price US$5.00-500.00 / Piece US$0.55-0.66 / Piece US$0.01-20.00 / Piece US$0.01-20.00 / Piece US$0.01-20.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms - LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Insulation Materials: Organic Resin;
      Flame Retardant Properties: HB;
      Application: Aerospace;
      Product Name: High Complexity PCBA;
      Service: PCB+Assembly+Components;
      Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
      Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
      Technical Support: Free Dfm/a Check, Bom Analysis;
      Placement Precision: ±0.03mm / ±0.01mm (Chip);
      Insulation Materials: Organic Resin;
      Flame Retardant Properties: HB;
      Application: Aerospace;
      Board Thickness: 1.6mm Rigid and 0.1mm Flex;
      Copper Thickness: 1oz;
      Solder Mask: Green and Yellow;
      Silk Screen: White;
      Material: Fr4 + Polymide;
      PCB Type: Rigid-Flexible PCB;
      Test: 100% Test;
      Small Order: Accepted;
      Lead Time: 5-10 Days;
      Service: High Quality;
      Dielectric: Fr-4;
      Insulation Materials: Metal Composite Materials;
      Flame Retardant Properties: HB;
      Application: Digital Products;
      Structure: Double-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Conductive Adhesive: Conductive Silver Paste;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Flame Retardant Properties: HB;
      Application: Digital;
      Structure: Double-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Conductive Adhesive: Conductive Silver Paste;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Flame Retardant Properties: V1;
      Application: LED,Equipment, Device;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Conductive Adhesive: Conductive Silver Paste;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Supplier Name

      Primustron Electronics

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier