| Specification |
Insulation Materials: Organic Resin;
Flame Retardant Properties: HB;
Application: Aerospace;
Product Name: High Complexity PCBA;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: HB;
Application: It Is on You;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 2 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
Small Order: Accepted;
Dielectric: Fr4 and Polyimide;
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Insulation Materials: Epoxy Resin;
Flame Retardant Properties: HB;
Application: Aerospace;
Board Material: Pi+Fr4;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1;
Min. Line Spacing: 0.08mm;
Soldermask: Green, Blue, White, Yellow;
Silkscreen: Green, Blue, White, Yellow;
Surface: Enig;
Layers: 1 -50 Layers;
Testing: 100%;
Service: One- Stop;
File: PCB File;
MOQ: 1 PCS;
Supply: Fast;
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Board Material: Pi+Fr4;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1;
Min. Line Spacing: 0.08mm;
Soldermask: Green, Blue, White, Yellow;
Silkscreen: Green, Blue, White, Yellow;
Surface: Enig;
Layers: 1 -50 Layers;
Testing: 100%;
Service: One- Stop;
File: PCB File;
MOQ: 1 PCS;
Supply: Fast;
Dielectric: FR-4;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: HB;
Application: Aerospace;
Board Material: Pi+Fr4;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1;
Min. Line Spacing: 0.08mm;
Soldermask: Green, Blue, White, Yellow;
Silkscreen: Green, Blue, White, Yellow;
Surface: Enig;
Layers: 1 -50 Layers;
Testing: 100%;
Service: One- Stop;
File: PCB File;
MOQ: 1 PCS;
Supply: Fast;
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