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      Shenzhen PCB
      US$0.50-8.00 / pieces
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      What is Smart Electronics High-Quality PCBA Board Customization SMT DIP Assembly PCB Circuit Board

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      5-99 pieces US$8.00

      100-999 pieces US$5.00

      1,000+ pieces US$0.50

      Sepcifications

      • Type Multilayer PCB
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Fr4.Tg.Cem-1, Aluminium
      • Insulation Materials Organic Resin
      • Brand Smart
      • Transport Package Carton
      • Specification custom
      • Trademark Smart
      • Origin Guangdong, China
      • Number of Layers 2/4/6/8/12/14 or Custom
      • Copper Thickness 0.5-6.0oz
      • Board Size Custom
      • PCB Cutting Shear V-Score, Tab-Routed
      • Min Trace/Gap 0.075mm or 3mil
      • Board Thickness 0.2-4.0mm

      Product Description

      CUSTOM PCB&PCBA,Please send us gerber file and bom list. PCBA PCB+components sourcing+assembly+package Assembly details SMT and Thru-hole, ISO SMT and DIP lines Lead Time Prototype : 15 work days. Mass order : 20~25 work days Testing on products Testing jig/mold , X-ray Inspection, AOI Test, ...

      Learn More

      Shenzhen PCB Comparison
      Transaction Info
      Price US$0.50-8.00 / pieces US$10.00 / Piece US$0.03-10.00 / Piece US$0.03-10.00 / Piece US$0.0001-99.00 / Piece
      Min Order 5 pieces 5 Pieces 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Multilayer PCB;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4.Tg.Cem-1, Aluminium;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Number of Layers: 2/4/6/8/12/14 or Custom;
      Copper Thickness: 0.5-6.0oz;
      Board Size: Custom;
      PCB Cutting: Shear V-Score, Tab-Routed;
      Min Trace/Gap: 0.075mm or 3mil;
      Board Thickness: 0.2-4.0mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Mu Star;
      Solder Mask Color: Green, Red, Black (as Your Require);
      Silkscreen Color: White, Black;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      Layers: 1-64;
      MOQ: 5PCS;
      Warranty: 2 Years;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Layers: 4 Layers;
      Solder Mask: Green;
      Legend: Write;
      Surface Finish: Enig (2u'');
      Thickness: 1.6mm;
      HDI: Blind Via & Buried Via;
      Supplier Name

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Mu Star (Shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier