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      Customization FPC
      US$1.00 / pieces
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      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      5 pieces US$1.00 / pieces

      Sepcifications

      • Structure Multilayer FPC
      • Material Polyimide
      • Combination Mode Adhesive Flexible Plate
      • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
      • Conductive Adhesive Conductive Silver Paste
      • Flame Retardant Properties V0
      • Processing Technology Delay Pressure Foil
      • Base Material Pl, Copper and Ni/Au
      • Insulation Materials Organic Resin
      • Brand Smart
      • Transport Package Carton
      • Specification Customized
      • Trademark Smart
      • Origin Guangdong, China
      • Supplier Type Manufacturer
      • Copper Thickness 0.5oz
      • Min. Hole Size 0.15mm
      • Min.Line Width 0.075mm
      • Stiffener Without, Top, Bot, Both Sides
      • Solder Mask(Coverlay) Yellow, White, Black
      • Board Thickness 0.057 to 0.6mm
      • Surface Finishing Enig, Immersion Silver, OSP

      Product Description

      Serial Number Item Process Capability Tolerance 01 Number of layers 1-16 MAX:500X3000MM 02 Production plate size MAX:250X3000MM 0.08MM 03 Drilled Hole Diameter MIN:250X1500MM 0.03MM 04 Tolerance of drilled hole diameter 6.5MM/0.1MM 15-40UM 05 Copper thickness in hole ...

      Learn More

      Customization FPC Comparison
      Transaction Info
      Price US$1.00 / pieces US$0.86-2.48 / Piece US$0.23-0.48 / Piece US$0.85-3.45 / Piece US$0.25-0.50 / Piece
      Min Order 5 pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Pl, Copper and Ni/Au;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz;
      Min. Hole Size: 0.15mm;
      Min.Line Width: 0.075mm;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Board Thickness: 0.057 to 0.6mm;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Board Material: Fr4;
      Board Layer: 4;
      Board Thickness: 1.6mm;
      Copper Thickness: 1 Oz;
      Min. Line Width/Space: 0.1mm;
      Min. Hole Size: 0.2mm;
      Solder Mask: Green/Blue/ White/ Black/ Red;
      Silkscreen: White/Yellow;
      Surface Finishing: HASL-Lf;
      Lead Time: 8-10 Working Days;
      Supply: Fast;
      Service: One-Stop;
      Testing: 100%;
      MOQ: 1 PCS;
      Shipping Type: DHL, UPS, FedEx, TNT, EMS etc.;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Fr4 and Polyimide;
      Board Layer: 2 Layer Rigide and 2 Layer Flex;
      Copper Thickness: 1 Oz;
      Min. Line Space: 0.1mm;
      Min.Hole Size: 0.15mm;
      Solder Mask: Any Color;
      Silkscreen: Any Color;
      Surface Finishing: Gold Plate;
      Lead Time: 5-6 Working Days;
      Max PCB Size: 650*650mm;
      Surface Finishing&#160;: HASL, Immersion Gold, OSP;
      Plugged Diameter: 8mil-20mil; 0.20mm-0.50mm);
      Laser Drilling Hole Size: 4mil(0.1mm);
      Drilling Bit Size CNC): 6mil-256mil;
      Boardness: +/-10%;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Fr4 and Polyimide;
      Board Layer: 2 Layer Rigide and 2 Layer Flex;
      Copper Thickness: 1 Oz;
      Min. Line Space: 0.1mm;
      Min.Hole Size: 0.15mm;
      Solder Mask: Any Color;
      Silkscreen: Any Color;
      Surface Finishing: Gold Plate;
      Lead Time: 5-6 Working Days;
      Max PCB Size: 650*650mm;
      Surface Finishing&#160;: HASL, Immersion Gold, OSP;
      Plugged Diameter: 8mil-20mil; 0.20mm-0.50mm);
      Laser Drilling Hole Size: 4mil(0.1mm);
      Drilling Bit Size CNC): 6mil-256mil;
      Boardness: +/-10%;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Fr4 and Polyimide;
      Board Layer: 2 Layer Rigide and 2 Layer Flex;
      Copper Thickness: 1 Oz;
      Min. Line Space: 0.1mm;
      Min.Hole Size: 0.15mm;
      Solder Mask: Any Color;
      Silkscreen: Any Color;
      Surface Finishing: Gold Plate;
      Lead Time: 5-6 Working Days;
      Max PCB Size: 650*650mm;
      Surface Finishing&#160;: HASL, Immersion Gold, OSP;
      Plugged Diameter: 8mil-20mil; 0.20mm-0.50mm);
      Laser Drilling Hole Size: 4mil(0.1mm);
      Drilling Bit Size CNC): 6mil-256mil;
      Boardness: +/-10%;
      Supplier Name

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier