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Jetson Orin

US$120.00-268.00 / Piece

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What is 4GB 8GB Developer Kit Ai Embedded Development Board Computer Carrier Board Case Module Nvidia Jetson Orin Nano Module

Name: 4GB 8GB Developer Kit Ai Embedded Development Board Computer Carrier Board Case Module Nvidia Jetson Orin Nano Module
Uploaded: 2026-01-10T14:35:21+08:00
Description: Specification Audio RTL8111H 1000 Mbps Storage Support 2260/2280 SSD Printed Circuit Board Six Layer Main Board Structure Integrated LED Lighting RGB Max LAN Speed 10/100/1000/2500Mbps PCI-E Standard

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About this Item

Price

Min. Order Reference FOB Price

3 Pieces US$120.00-268.00 / Piece

Sepcifications

Integrated Graphics Integrated Graphics
Main Chipset Intel
Maximum Memory Capacity 64G
Structure Micro ATX
Memory DDR3
SATA Interface SATA3.0
CPU Socket LGA1700
Printed Circuit Board Four Layers
Main Board Structure Integrated
Audio Effects Not HiFi
Transport Package Color Box
Specification 17cm(L)*17cm(W)*23mm(H)
Trademark OEM/ODM
Origin Guangdong, China
Power Supply DC 12V or 19V Voltage
CPU Processor Alder Lake 12th Generation Core I5
Working Humidity 5%~95% Relative Humidity
Switch 1*F_Panel Pin;1*Jatx Pin

Product Description

Specification Audio RTL8111H 1000 Mbps Storage Support 2260/2280 SSD Printed Circuit Board Six Layer Main Board Structure Integrated LED Lighting RGB Max LAN Speed 10/100/1000/2500Mbps PCI-E Standard PCI-E 5.0 Power Interface 24pin/8pin BIOS Performance 128 MB Flash ROM/Uefi Ami BIOS USB 4 * USB 3.0 ...

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Shenzhen Huaxing Technology Co., Ltd.

Gold Member Since 2023

Audited Supplier

Main Products Hard Disk, RAM Server, Motherboard, Storage, SSD, Computer Case, Network Switch, Gaming ...
Year of Establishment 2012-04-01
Address Floor 3th,Bldg A2,Penghongxin Industrial Park,Xixiang,Baoan District,Shenzhen,China
International Commercial Terms(Incoterms) FOB, EXW, CIF, DDP
Terms of Payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Export Year 13Years

Jetson Orin Comparison

	4GB 8GB Developer Kit Ai Embedded Development Board Computer Carrier Board Case Module Nvidia Jetson Orin Nano Module Contact Now	Chipset LGA X58-1366 Support DDR3 ATX Motherboard Contact Now	Quick View Micro ATX H61 Chipset 1155 Socket Support 2*DDR3 Motherboard Contact Now	Quick View G41-Gl40 Chipset 775 Socket Support 2*DDR3 Motherboard Contact Now	Quick View G965 Chipset LGA 775 Support DDR2 PC Motherboard Contact Now

Transaction Info
	4GB 8GB Developer Kit Ai Embedded Development Board Computer Carrier Board Case Module Nvidia Jetson Orin Nano Module Contact Now	Chipset LGA X58-1366 Support DDR3 ATX Motherboard Contact Now	Quick View Micro ATX H61 Chipset 1155 Socket Support 2*DDR3 Motherboard Contact Now	Quick View G41-Gl40 Chipset 775 Socket Support 2*DDR3 Motherboard Contact Now	Quick View G965 Chipset LGA 775 Support DDR2 PC Motherboard Contact Now
Price	US$120.00-268.00 / Piece	US$34.00-37.00 / Piece	US$34.76-38.65 / Piece	US$34.76-38.65 / Piece	US$34.76-38.65 / Piece
Min Order	3 Pieces	10 Pieces	2 Pieces	2 Pieces	2 Pieces
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	South America, Southeast Asia/ Mideast, Africa	South America, Southeast Asia/ Mideast, Africa	South America, Southeast Asia/ Mideast, Africa	South America, Southeast Asia/ Mideast, Africa
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 64G; Structure: Micro ATX; Memory: DDR3; SATA Interface: SATA3.0; CPU Socket: LGA1700; Printed Circuit Board: Four Layers; Main Board Structure: Integrated; Audio Effects: Not HiFi; Power Supply: DC 12V or 19V Voltage; CPU Processor: Alder Lake 12th Generation Core I5; Working Humidity: 5%~95% Relative Humidity; Switch: 1F_Panel Pin;1Jatx Pin;	Main Chipset: Intel; Maximum Memory Capacity:  Double Channel.; Structure: ATX; Memory: DDR3; SATA Interface: SATA2.0; CPU Socket: LGA 1366; Chipset: Intel X58+Ich10; Fsb: DDR3 1066/1333/1600 Double Channel.; Size: 280mmx216mm; Memory Modules: DDR3 1600/1333; Intel: X58;	Main Chipset: Intel; Structure: ATX; Memory: DDR3; CPU Socket: LGA 1155; Chipset: Intel H61; CPU: I3/I5/I7; Size: 16.8cm18.8cm;*	Main Chipset: Intel; Structure: ATX; Memory: DDR3; CPU Socket: LGA 775; Chipset: G45+Ich7; Fsb: 1333/1066/800/533 MHz; Size: 16.8cm21.2cm;*	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Structure: ATX; Memory: DDR3; CPU Socket: LGA 775; Chipset: G965; CPU Fsb: 1066/800/533MHz; Size: 16.8cm21.2cm;* Shipping Term: by Air / by Sea /by Express; Brand: OEM; Origin of Place: Shenzhen ,China;
Supplier Name	Shenzhen Huaxing Technology Co., Ltd.	Shenzhen DJS Co., Ltd.	Shenzhen DJS Co., Ltd.	Shenzhen DJS Co., Ltd.	Shenzhen DJS Co., Ltd.
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