| Specification |
Type: Flexible Circuit Board;
Dielectric: Pi;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Copper Thickness: 1oz;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Promotional LED PCB Board with Good Price;
Layer: 1-18;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.15mm;
Min Trace: 0.15mm;
Surface Finishing: Enig;
Solder Mask: Any;
Lead Time: 4-5 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1-50;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacumm;
Lead Time: 5-7 Days;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 8 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Immesion Gold;
Lead Time: 6-8 Working Days;
Min.Hole Size: 0.15mm;
Min. Line Space: 0.1mm;
Text: Flying Probe Text;
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