| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Bluetooth;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 8;
Material Finished Thickness: 1.6mm;
Special: Rogers 4003c;
Finished Copper Thickness: 1oz;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
Lead Time: 12 Working Days;
Fast Turn: 5 Working Days;
PCB Testing: E-Testing, Flying Probe Testing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: Woven E-Glass Reinforced Epoxy Resin;
Material: High-Tg Modified Fr-4 Composite;
Application: RF Devices;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig/HASL/OSP;
Base Material: High-Tg Modified Fr-4 Composite;
Insulation Materials: Fiberglass-Reinforced Polymer Matrix;
Brand: Shengyi;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: Woven E-Glass Reinforced Epoxy Resin;
Material: Shengyi S1000-2m;
Application: RF Devices;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Shengyi S1000-2m;
Insulation Materials: Fiberglass-Reinforced Polymer Matrix;
Brand: Shengyi;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: Iteq It-180A Fr-4 Laminate;
Material: High-Tg (≥170°c) Epoxy Resin System;
Application: Industrial Automation (PLC Controllers);
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Shengyi S1000-2m;
Insulation Materials: Fiberglass-Reinforced Composite;
Brand: Iteq;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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