| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Fr4,High Tg Fr4,Aluminum,Rogers,Cem-3,Cem-1 etc;
Insulation Materials: Epoxy Resin;
Product Name: PCB Board;
Layer: 1~20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
Min Board Size: 8*8mm;
Board Thickness: 0.3mm~3.5mm;
Max Board Size: 650*610mm;
Min Hole Size: 0.2mm;
Surface Finish: HASL/HASL Lf/OSP/Immersion Gold/Tin/ Silver;
Value-Added Service: Layout;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PCBA Manufacturer;
Layer: 1-18 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5, 1oz, 2oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: CE, LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days; PCBA, 2-3weeks;
Servicve: PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
Product Name: Factory Design and Assembly Service Rigid Multi-La;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: New Chip;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
Service: OEM / Dfm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer, LED, Medical, Industrial, Control Board;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: OEM PCB Board;
MOQ: 1 PCS;
Layer: 1-12 Layers;
Min Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Copper Thickness: 0.5 Oz-3oz (18 Um-385 Um);
Board Thickness: 0.2mm-4mm;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
PCB Service: PCB Board/PCBA/PCB Design and Layout;
Test Service: X-ray, Aoi Test, Function Test(100% Test);
Other Service: PCB/PCBA Layout and Design;
Package: ESD Bag, Foam, Carton Box;
Product Name: ISO9001 Electronics PCBA Assembly 94V0 RoHS PCB;
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