| Specification |
Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT,DIP;
Layers: Multilayer;
Base Material: Fr4,High-Tg Fr4,Cem3,Aluminum,High Frequency(Roger;
Customized: Customized;
Condition: New;
Layer Counts: 1--58L;
Material Thickness(mm): 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4;
Max Board Size(mm): 1200X400mm;
Board Outline Tolerance: ±0.15mm;
Board Thickness: 0.4mm--3.2mm;
Thickness Tolerance: ±8%;
Minimum Line/Space: 0.1mm;
Min Annular Ring: 0.1mm;
SMD Pitch: 0.3mm;
Min Hole Size(Mechanical): 0.2mm;
Min Hole Size(Laser Hole): 0.1mm;
Hole Size Tol (+/-): Pth:±0.075mm;Npth: ±0.05mm;
Hole Position Tol: ±0.075mm;
HASL/Lf Hal: 2.5um;
Copper Weight: 0.5--6oz;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4, FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr4, FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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