What is Shenzhen OEM ODM Design Reverse Rigid Fr-4 Manufacturer Printed Circuit Board Multilayer Electronic PCB Board Fabrication Mass Pr0oduction Quick Prototype

Name: Shenzhen OEM ODM Design Reverse Rigid Fr-4 Manufacturer Printed Circuit Board Multilayer Electronic PCB Board Fabrication Mass Pr0oduction Quick Prototype
Uploaded: 2026-03-22T16:34:11+08:00
Description: Shenzhen OEM ODM Design Reverse Rigid FR-4 Manufacturer Printed Circuit Board Multilayer Electronic PCB Board Fabrication Mass Pr0oduction quick prototype No MOQ 1 - 50 Layer pcb for Electronic P

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Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.90

1,000-1,999 Pieces US$0.82

2,000-9,999,999 Pieces US$0.71

10,000,000+ Pieces US$0.60

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Fr4
Insulation Materials Epoxy Resin
Brand Ca
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Board Thickness 1.6mm
Board Layer 2 Layers
Copper Thickness 1 Oz
Solder Mask Blue
Silksreen White
Min Pad +/- 0.1mm (4mil)
Surface Finihsing HASL-Lf
Lead Time 6-8 Working Days
Shipping Type DHL, UPS, TNT, EMS, FedEx etc
Packing Type Carton + Vacuum
Test Fly Probe Testing
Min Board Thickness 0.1mm Only for Single and Double Sided
Min. Line Width/Space 0.05mm (2mil)
Outline Machining Accuracy +/- 0.1mm (4mil)
MOQ 1 PCS

Product Description

Shenzhen OEM ODM Design Reverse Rigid FR-4 Manufacturer Printed Circuit Board Multilayer Electronic PCB Board Fabrication Mass Pr0oduction quick prototype No MOQ 1 - 50 Layer pcb for Electronic Products. FR4 PCB, LED PCB, Aluminum based PCB, HDI PCB, Rigid-flex PCB, heavy copper PCB, and PCB ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Rigid Fr-4 Manufacturer Comparison

	Shenzhen OEM ODM Design Reverse Rigid Fr-4 Manufacturer Printed Circuit Board Multilayer Electronic PCB Board Fabrication Mass Pr0oduction Quick Prototype Contact Now	Quick View 2oz Aluminum Circuit Board LED Lighting Ceramic Substrate PCB Contact Now	Quick View LED PCB Aluminum Print Circuits Board Single Side 1oz/2oz Light PCB Board with Lamp Contact Now	Green Solder Mask White Overlay Rigid PCB Board Contact Now	Green Ink 1oz Copper PCB Rigid Circuit Board Contact Now

Transaction Info
	Shenzhen OEM ODM Design Reverse Rigid Fr-4 Manufacturer Printed Circuit Board Multilayer Electronic PCB Board Fabrication Mass Pr0oduction Quick Prototype Contact Now	Quick View 2oz Aluminum Circuit Board LED Lighting Ceramic Substrate PCB Contact Now	Quick View LED PCB Aluminum Print Circuits Board Single Side 1oz/2oz Light PCB Board with Lamp Contact Now	Green Solder Mask White Overlay Rigid PCB Board Contact Now	Green Ink 1oz Copper PCB Rigid Circuit Board Contact Now
Price	US$0.60-0.90 / Piece	US$0.01-200.00 / Piece	US$0.10-20.00 / Piece	US$0.10-80.00 / Piece	US$0.10-80.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	-	-	-	UL,ISO9001&ISO14001,SGS,RoHS Report	UL,ISO9001&ISO14001,SGS,RoHS Report
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Ca; Board Thickness: 1.6mm; Board Layer: 2 Layers; Copper Thickness: 1 Oz; Solder Mask: Blue; Silksreen: White; Min Pad: +/- 0.1mm (4mil); Surface Finihsing: HASL-Lf; Lead Time: 6-8 Working Days; Shipping Type: DHL, UPS, TNT, EMS, FedEx etc; Packing Type: Carton + Vacuum; Test: Fly Probe Testing; Min Board Thickness: 0.1mm Only for Single and Double Sided; Min. Line Width/Space: 0.05mm (2mil); Outline Machining Accuracy: +/- 0.1mm (4mil); MOQ: 1 PCS;	Structure: Double-Sided Rigid PCB; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Cooper Thickness: 2 Oz; Board Thickness: 2.0 mm; Materil: Metal Core;	Structure: Flush Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Kb,Shenyi,Rogers,Iteq; Shenzhen: China;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Shengyi; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';
Supplier Name	Fastline Circuits Co., Limited	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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