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WiFi Module

US$0.10-0.50 / Piece

CSR1010 Bluetooth Mesh Module BLE Bluetooth 4.0 Uart Transceiver Module Cc2541 Hm-10 pictures & photos

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What is CSR1010 Bluetooth Mesh Module BLE Bluetooth 4.0 Uart Transceiver Module Cc2541 Hm-10

Name: CSR1010 Bluetooth Mesh Module BLE Bluetooth 4.0 Uart Transceiver Module Cc2541 Hm-10
Uploaded: 2026-01-28T04:40:15+08:00
Description: Product Parameters Packaging & Shipping Packaging Detail: Anti-static bag, bubble pack, carton box,Vacuum... Delivery Detail: 3-15Days, delivery just-in-time Company Profile NEW CHIP INTERNATIONAL

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.50 / Piece

Sepcifications

Type Flexible Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China

Product Description

Product Parameters Packaging &Shipping Packaging Detail: Anti-static bag, bubble pack, carton box,Vacuum... Delivery Detail: 3-15Days, delivery just-in-time Company Profile NEW CHIP INTERNATIONAL LIMITED (Hereafter called NEW CHIP) is a professional agent and distributor of electronic ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Year of Establishment 2022-05-11
Number of Employees 10
Address A904, plant 3, Longgang Tian'an Digital Innovation Park, No. 449, Huangge North Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen

WiFi Module Comparison

	CSR1010 Bluetooth Mesh Module BLE Bluetooth 4.0 Uart Transceiver Module Cc2541 Hm-10 Contact Now	Quick View Custom Design Multilayer Printed Board Circuit Contact Now	Quick View Multi Layers Electronics PCB Printed Circuits Board Made of Fr4 Tg150 with 2 U" Enig in Blue Ink Contact Now	Quick View Air Conditioning PCB Board Circuit Board with UL, SGS, ISO Certificates Contact Now	Quick View Fr4 Substrate 4oz Copper Custom Design PCB Manufacturing Service Contact Now

Transaction Info
	CSR1010 Bluetooth Mesh Module BLE Bluetooth 4.0 Uart Transceiver Module Cc2541 Hm-10 Contact Now	Quick View Custom Design Multilayer Printed Board Circuit Contact Now	Quick View Multi Layers Electronics PCB Printed Circuits Board Made of Fr4 Tg150 with 2 U" Enig in Blue Ink Contact Now	Quick View Air Conditioning PCB Board Circuit Board with UL, SGS, ISO Certificates Contact Now	Quick View Fr4 Substrate 4oz Copper Custom Design PCB Manufacturing Service Contact Now
Price	US$0.10-0.50 / Piece	US$0.10-80.00 / Piece	US$0.01-100.00 / Piece	US$0.01-150.00 / Piece	US$0.10-80.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	-	UL, ISO9001&ISO14001, SGS, RoHS Report	-	-	UL, ISO9001&ISO14001, SGS, RoHS, Ts16949
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-8mm; Copper Thickness: 0.5-10oz; Layers: 1-32layers; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layers: 6; Board Thickness: 1.6mm; Raw Material: Fr4 Tg150; Panel up: 1010;* Surface Finish: Immersion Gold; Legend: White; Inner Copper: 35um; Outer Copper: 70um;	Type: Rigid Circuit Board; Dielectric: FR-4; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Kb; Cooper Thickness: 1oz; Surface Finishing: Immersion Gold; Solder Mask Color: Green; Silkscreen: White; Min Line Width/Space: 0.2mm/0.2mm; Min Hole Diameter: 0.2mm; Finished Board Thickness: 1.6 mm; Layer: 6 Layer;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-8mm; Copper Thickness: 0.5-10oz; Layers: 1-32layers; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';
Supplier Name	Shenzhen New Chip international Ltd	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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