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      Android Development Board
      US$53.90-57.80 / Piece
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      What is Waterproof Rk3568 Android System Mainboard for Outdoor and Marine Electronics

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      2 Pieces US$53.90-57.80 / Piece

      Sepcifications

      • Integrated Graphics Integrated Graphics
      • Main Chipset Rockchip
      • Maximum Memory Capacity 8G
      • Structure ATX
      • Memory DDR2
      • SATA Interface SATA3.0
      • CPU Socket LGA 775
      • Printed Circuit Board Six Layer
      • Main Board Structure Integrated
      • Audio Effects HiFi
      • Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
      • Specification Customized
      • Trademark customized
      • Origin Shenzhen, China
      • Name PCBA Assembly Manufacturing
      • Inspection 100% IQC, Ipqc, Fqc, QA, Ict
      • Advantages PCB Design/Assembly, PCBA & EMS
      • Good Services SMT, BGA and DIP
      • Production Type SMT & DIP & Assembling & Testing
      • Certificate UL94V-0+RoHS
      • Services OEM&ODM Manufacturer Since 2005
      • Item Control Board PCBA

      Product Description

      Product Description Linux Android Mainboard Android Arm Linux PCBA RK3568 Development Board System CPU Rockchip RK3568, ARM 4Core A55,Up to 2.4GHz GPU Mail-G52 2EE NPU Support 0.8Tops Computing power RAM With Standard 2GB/4GB/8GB LPDDR4 R0M With Standard 16GB EMMC,Up to 128GB Display ...

      Learn More

      Android Development Board Comparison
      Transaction Info
      Price US$53.90-57.80 / Piece US$92.00-100.00 / Piece US$99.00-105.00 / Piece US$97.00-103.00 / Piece US$120.00-122.00 / Piece
      Min Order 2 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
      Quality Control
      Product Certification UL94V-0+RoHS - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe Domestic Domestic Domestic Domestic
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Rockchip;
      Maximum Memory Capacity: 8G;
      Structure: ATX;
      Memory: DDR2;
      SATA Interface: SATA3.0;
      CPU Socket: LGA 775;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Audio Effects: HiFi;
      Name: PCBA Assembly Manufacturing;
      Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
      Advantages: PCB Design/Assembly, PCBA & EMS;
      Good Services: SMT, BGA and DIP;
      Production Type: SMT & DIP & Assembling & Testing;
      Services: OEM&ODM Manufacturer Since 2005;
      Item: Control Board PCBA;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 8G;
      Structure: Nano-Itx;
      Memory: DDR3;
      SATA Interface: SATA3.0;
      CPU Socket: Fcbga1168;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Audio Effects: Integrated Realtek Alc660/662/892 HD Digital Audio;
      Use: Commercial, Educational, Industrial, Home, Game;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 8G;
      Memory: DDR3;
      SATA Interface: SATA;
      CPU Socket: LGA 1150;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Chipset Manufacture: Intel;
      Item Condition: New;
      Socket Type: Intel Fcbga1170;
      Memory Type: 1* So-DDR3 1333/1600m Low Voltage(1.35V) Memory;
      Products Status: New, Stock;
      Form Factor: Nano Itx;
      Graphics Card Type: Integrating Intel HD Graphic GPU;
      Fsb / Ht: 2.41GHz~2.58GHz;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 8G;
      Memory: DDR3;
      SATA Interface: SATA;
      CPU Socket: LGA 1150;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Chipset Manufacture: Intel;
      Item Condition: New;
      Socket Type: Intel Fcbga1170;
      Memory Type: 1* So-DDR3 1333/1600m Low Voltage(1.35V) Memory;
      Products Status: New, Stock;
      Form Factor: Nano Itx;
      Graphics Card Type: Integrating Intel HD Graphic GPU;
      Fsb / Ht: 2.41GHz~2.58GHz;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 8G;
      Structure: Nano-Itx;
      Memory: DDR3;
      SATA Interface: SATA3.0;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Warranty: 1 Year;
      Memory Channel: Single;
      Chipset: Intel Chipset Haswell-U;
      Test Condition: 100% Tested Perfect;
      Frequency: Dual Cores 1.7GHz;
      Supplier Name

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Elsky Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Elsky Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Elsky Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Elsky Technology Co., Ltd.

      Diamond Member Audited Supplier